NeoDen 3V - Page 3

2.5.3.3. Inspection Standard..................................................................................................................30
2.6. Continuous SMT Production..................................................................................................................30
3. Structure and maintenance instruction..............................................................................................................31
3.1. Structure Chart................................................................................................................................................31
3.1.1. Peel Box...................................................................................................................................... 31
3.1.2. Tape Reel Loading.......................................................................................................................32
3.1.3. Nozzle..........................................................................................................................................32
3.1.3.1. Size of Nozzle.................................................................................................................. 32
3.1.3.2. Reference of Nozzle Selection.........................................................................................33
3.2. Maintenance........................................................................................................................................... 34
3.2.1. Reinforce Daily Maintenance..................................................................................................... 34
3.2.2. Requirement for Operator........................................................................................................... 34
3.2.3. Formulate Measures to Reduce/ Avoid Mistake......................................................................... 34
3.2.4. Maintenance of Device............................................................................................................... 35
3.2.4.1. Check Below Points Daily............................................................................................... 35
3.2.4.2. Check Below Points Monthly.......................................................................................... 35
3.2.5. Related Issues During Solder Paste Printing Process................................................................. 36
3.2.5.1. Stencil Printer Technology...............................................................................................36
3.2.5.2. Inspecting of Solder Paste Printing..................................................................................36
3.2.5.3. Instruction about Soldering Printing................................................................................37