Nvidia Jetson Orin Nano Series - Page 60

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PRELIMINARY INFORMATION
Jetson Orin NX Series and Jetson Orin Nano Series DG-10931-001_v1.1 | 49
Parameter
Requirement
Units
Notes
Stripline
Microstrip
162 (1120)
155 (900)
Trace spacing (Pair-Pair)
Stripline
Microstrip (HBR/RBR)
Microstrip (HBR2/HBR3)
3x
4x
5x to 7x
dielectric height
Trace spacing (Main Link to AUX):
Stripline/Microstrip
3x / 5x
dielectric height
Max Intra-pair (within pair) Skew
0.15 (1)
mm (ps)
Do not perform length (delay) matching
within breakout region. Do trace length
(delay) matching before hitting discontinuity
(i.e. matching to <1ps before the vias or any
discontinuity to minimize common mode
conversion).
Max Inter-pair (pair-pair) Skew
150
ps
Via
Max GND transition Via distance
< 1x
diff pair pitch
For signals switching reference layers, add
symmetrical GND stitching Via near signal
Vias.
Impedance dip
Recommended via dimension for impedance control
Drill/Pad
Antipad
Via pitch
200/400
>840
um
um
um
The via dimension must be required for the
HDMI-DP co-layout condition.
Topology
Y-pattern is recommended
keep symmetry
Xtalk suppression is best using the Y-
pattern. It can also reduce the limit of
pair-pair distance.
For in-line via, the distance from a via
of one lane to the adjacent via from
another lane >= 1.2 mm center-
center.
GND via
Place GND via as symmetrically as
possible to data pair vias. Up to 4
signal vias (2 diff pairs) can share a
single GND return via
GND via is used to maintain return path,
while its Xtalk suppression is limited
Max # of Vias
PTH vias
Micro Vias
4 if all vias are PTH via
Not limited if total channel loss meets
IL spec
Max Via Stub Length
0.4
mm
AC Cap
Value
0.1
uF
Discrete 0402
Max Dist. from AC cap to connector
RBR/HBR
HBR2/HBR3
No requirement
0.5
in