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PRELIMINARY INFORMATION
Jetson Orin NX Series and Jetson Orin Nano Series DG-10931-001_v1.1 | 49
Trace spacing (Pair-Pair)
Stripline
Microstrip (HBR/RBR)
Microstrip (HBR2/HBR3)
Trace spacing (Main Link to AUX):
Stripline/Microstrip
Max Intra-pair (within pair) Skew
Do not perform length (delay) matching
within breakout region. Do trace length
(delay) matching before hitting discontinuity
(i.e. matching to <1ps before the vias or any
discontinuity to minimize common mode
conversion).
Max Inter-pair (pair-pair) Skew
Max GND transition Via distance
For signals switching reference layers, add
symmetrical GND stitching Via near signal
Vias.
Impedance dip
Recommended via dimension for impedance control
Drill/Pad
Antipad
Via pitch
The via dimension must be required for the
HDMI-DP co-layout condition.
Y-pattern is recommended
keep symmetry
Xtalk suppression is best using the Y-
pattern. It can also reduce the limit of
pair-pair distance.
For in-line via, the distance from a via
of one lane to the adjacent via from
another lane >= 1.2 mm center-
center.
Place GND via as symmetrically as
possible to data pair vias. Up to 4
signal vias (2 diff pairs) can share a
single GND return via
GND via is used to maintain return path,
while its Xtalk suppression is limited
Max # of Vias
PTH vias
Micro Vias
4 if all vias are PTH via
Not limited if total channel loss meets
IL spec
Max Dist. from AC cap to connector
RBR/HBR
HBR2/HBR3