19. HOW TO REPLACE FLAT PACKAGE IC
19.1. Preparation
- SOLDER
Sparkle Solder 115A-1, 115B-1 or Almit Solder KR-19, KR-19RMA
- Soldering iron
Recommended power consumption will be between 30 W to 40 W.
Temperature of Copper Rod 662 ± 50°F (350 ± 10°C)
(An expert may handle between 60 W to 80 W iron, but beginner
might damage foil by overheating.)
- Flux
HI115 Specific gravity 0.863.
(Original flux will be replaced daily.)
19.2. Procedure
1. Temporary fix FLAT PACKAGE IC by soldering on two marked 2
pins.
*Most important matter is accurate setting of IC to the corresponding soldering foil.
2. Apply flux for all pins of FLAT PACKAGE IC.
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