Philips TDA8950 - Page 33

TDA8950_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 11 June 2009 33 of 39
NXP Semiconductors
TDA8950
2 × 150 W class-D power amplifier
Fig 29. Package outline SOT566-3 (HSOP24)
UNIT
A
4
(1)
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
03-02-18
03-07-23
IEC JEDEC JEITA
mm
+0.08
−0.04
3.5 0.35
DIMENSIONS (mm are the original dimensions)
Notes
1. Limits per individual lead.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
SOT566-3
0 5 10 mm
scale
HSOP24: plastic, heatsink small outline package; 24 leads; low stand-off height
SOT566-3
A
max.
detail X
A
2
3.5
3.2
D
2
1.1
0.9
H
E
14.5
13.9
L
p
1.1
0.8
Q
1.7
1.5
2.7
2.2
v
0.25
w
0.25
yZ
8°
0°
θ
0.07
x
0.03
D
1
13.0
12.6
E
1
6.2
5.8
E
2
2.9
2.5
b
p
c
0.32
0.23
e
1
D
(2)
16.0
15.8
E
(2)
11.1
10.9
0.53
0.40
A
3
A
4
A
2
(A
3
)
L
p
θ
A
Q
D
y
x
H
E
E
c
v M
A
X
A
b
p
w M
Z
D
1
D
2
E
2
E
1
e
24
13
1
12
pin 1 index