Philips TDA8950 - Package Related Soldering Information; 17 Revision History

TDA8950_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 11 June 2009 37 of 39
NXP Semiconductors
TDA8950
2 × 150 W class-D power amplifier
16.4 Package related soldering information
[1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
[2] For PMFP packages hot bar soldering or manual soldering is suitable.
17. Revision history
Table 14. Suitability of through-hole mount IC packages for dipping and wave soldering
Package Soldering method
Dipping Wave
CPGA, HCPGA - suitable
DBS, DIP, HDIP, RDBS, SDIP, SIL suitable suitable
[1]
PMFP
[2]
- not suitable
Table 15. Revision history
Document ID Release date Data sheet status Change notice Supersedes
TDA8950_2 20090611 Product data sheet TDA8950_1
Modifications
• Parameter values revised throughout.
• Revised Figure 4, Figure 10, Figure 11 and Figure 12.
TDA8950_1 20080909 Preliminary data sheet - -