Philips TDA8950 - Package outline

TDA8950_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 11 June 2009 32 of 39
NXP Semiconductors
TDA8950
2 × 150 W class-D power amplifier
14. Package outline
Fig 28. Package outline SOT411-1 (DBS23P)
UNIT A
2
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
4.6
4.3
A
4
1.15
0.85
A
5
1.65
1.35
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
SOT411-1
98-02-20
02-04-24
0 5 10 mm
scale
D
L
L
1
L
2
E
2
E
c
A
4
A
5
A
2
m
L
3
E
1
Q
w M
b
p
1
d
Z
e
2
e
e
123
j
DBS23P: plastic DIL-bent-SIL power package; 23 leads (straight lead length 3.2 mm)
SOT411-1
v M
D
x
h
E
h
non-concave
view B: mounting base side
B
β
e
1
b
p
cD
(1)
E
(1)
Z
(1)
deD
h
LL
3
m
0.75
0.60
0.55
0.35
30.4
29.9
28.0
27.5
12 2.54
12.2
11.8
10.15
9.85
1.27
e
2
5.08
2.4
1.6
E
h
6
E
1
14
13
L
1
10.7
9.9
L
2
6.2
5.8
E
2
1.43
0.78
2.1
1.8
1.85
1.65
4.3
3.6
2.8
Qj
0.25
w
0.6
v
0.03
x
45°
β