Quectel AF20 - Page 8

Wi-Fi&Bluetooth Module Series
AF20_Hardware_Design
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5.1. Mechanical Dimensions ............................................................................................................. 38
5.2. Recommended Footprint ............................................................................................................40
5.3. Top and Bottom Views ................................................................................................................41
6 Storage, Manufacturing and Packaging ...........................................................................................42
6.1. Storage Conditions .....................................................................................................................42
6.2. Manufacturing and Soldering .....................................................................................................43
6.3. Packaging Specification .............................................................................................................45
6.3.1. Carrier Tape .....................................................................................................................45
6.3.2. Plastic Reel ......................................................................................................................46
6.3.3. Packaging Process ..........................................................................................................46
7 Appendix References ......................................................................................................................... 48