Quectel EC25 Hardware Design

LTE Module Series
EC25 Mini PCIe Hardware Design
EC25_Mini_PCIe_Hardware_Design Confidential / Released 11 / 42
3.
3)
B2 band on EC25-AU Mini PCIe module does not support receive diversity.
2.3. Key Features
The following table describes the detailed features of EC25 Mini PCIe module.
Table 2: Key Features of EC25 Mini PCIe
Feature
Details
Function Interface
PCI Express Mini Card 1.2 Standard Interface
Power Supply
Supply voltage: 3.0~3.6V
Typical supply voltage: 3.3V
Transmitting Power
Class 4 (33dBm±2dB) for GSM850
Class 4 (33dBm±2dB) for GSM900
Class 1 (30dBm±2dB) for DCS1800
Class 1 (30dBm±2dB) for PCS1900
Class E2 (27dBm±3dB) for GSM850 8-PSK
Class E2 (27dBm±3dB) for GSM900 8-PSK
Class E2 (26dBm±3dB) for DCS1800 8-PSK
Class E2 (26dBm±3dB) for PCS1900 8-PSK
Class 3 (24dBm+1/-3dB) for WCDMA bands
Class 3 (23dBm±2dB) for LTE-FDD bands
Class 3 (23dBm±2dB) for LTE-TDD bands
LTE Features
Support up to non-CA Cat 4
Support 1.4 to 20MHz RF bandwidth
Support MIMO in DL direction
FDD: Max 50Mbps (UL), 150Mbps (DL)
TDD: Max 35Mbps (UL), 130Mbps (DL)
WCDMA Features
Support 3GPP R8 DC-HSPA+
Support 16-QAM, 64-QAM and QPSK modulation
3GPP R6 Cat 6 HSUPA: Max 5.76Mbps (UL)
3GPP R8 Cat 24 DC-HSPA+: Max 42Mbps (DL)
GSM Features
R99:
CSD: 9.6kbps, 14.4kbps
GPRS:
Support GPRS multi-slot class 12 (12 by default)
Coding scheme: CS-1, CS-2, CS-3 and CS-4
Maximum of four Rx time slots per frame
Quectel
Confidential

Quectel EC25 Specifications

General

Category	LTE Module
LTE TDD	B38/B40/B41
WCDMA	B1/B5/B8
GSM	850/900/1800/1900 MHz
Data rates	LTE Cat 4: 150 Mbps DL/50 Mbps UL
GNSS	GPS/GLONASS/BeiDou/Galileo/QZSS
Operating Temperature	-40°C to +85°C
Form Factor	LCC
Storage Temperature	-45°C to +90°C
SIM Interface	1.8V/3.0V
Antenna Interface	Main, Diversity, GNSS
LTE FDD	B1/B3/B5/B7/B8/B20
Interfaces	USB 2.0, UART, PCM, GPIO
Operating Voltage	3.3V - 4.3V
Protocols	TCP/IP, UDP, FTP, HTTP, HTTPS
Certifications	CE, FCC, PTCRB, GCF, RCM, IC