Quectel EC25 Hardware Design

LTE Module Series
EC25 Mini PCIe Hardware Design
EC25_Mini_PCIe_Hardware_Design Confidential / Released 14 / 42
3 Application Interface
3.1. General Description
The physical connections and signal levels of EC25 Mini PCIe comply with PCI Express Mini CEM
specifications. This chapter mainly describes the following interfaces’ definition and application of EC25
Mini PCIe:
 Power supply
 USIM card interface
 USB interface
 UART interface
 PCM&I2C interfaces
 Control signals
 Antenna interface
3.2. EC25 Mini PCIe Interface
3.2.1. Definition of Interface
The following tables show the pin definition and description of EC25 Mini PCIe on the 52-pin application.
Table 3: Definition of I/O Parameters
Type
Description
IO
Bidirectional
DI
Digital input
DO
Digital output
OC
Open collector
PI
Power input
PO
Power output
Quectel
Confidential

Quectel EC25 Specifications

General

Category	LTE Module
LTE TDD	B38/B40/B41
WCDMA	B1/B5/B8
GSM	850/900/1800/1900 MHz
Data rates	LTE Cat 4: 150 Mbps DL/50 Mbps UL
GNSS	GPS/GLONASS/BeiDou/Galileo/QZSS
Operating Temperature	-40°C to +85°C
Form Factor	LCC
Storage Temperature	-45°C to +90°C
SIM Interface	1.8V/3.0V
Antenna Interface	Main, Diversity, GNSS
LTE FDD	B1/B3/B5/B7/B8/B20
Interfaces	USB 2.0, UART, PCM, GPIO
Operating Voltage	3.3V - 4.3V
Protocols	TCP/IP, UDP, FTP, HTTP, HTTPS
Certifications	CE, FCC, PTCRB, GCF, RCM, IC