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Quectel EC25 Hardware Design

Quectel EC25
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LTE Module Series
EC25 Mini PCIe Hardware Design
EC25_Mini_PCIe_Hardware_Design Confidential / Released 7 / 42
1 Introduction
This document defines EC25 Mini PCIe module, and describes its hardware interfaces which are
connected with your application as well as its air interfaces.
This document can help you to quickly understand the interface specifications, electrical and mechanical
details as well as other related information of EC25 Mini PCIe module. To facilitate its application in
different fields, relevant reference design documents are also provided. Associated with application note
and user guide of EC25 Mini PCIe module, you can use the module to design and set up mobile
applications easily.
Quectel
Confidential

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Quectel EC25 Specifications

General IconGeneral
CategoryLTE Module
LTE TDDB38/B40/B41
WCDMAB1/B5/B8
GSM850/900/1800/1900 MHz
Data ratesLTE Cat 4: 150 Mbps DL/50 Mbps UL
GNSSGPS/GLONASS/BeiDou/Galileo/QZSS
Operating Temperature-40°C to +85°C
Form FactorLCC
Storage Temperature-45°C to +90°C
SIM Interface1.8V/3.0V
Antenna InterfaceMain, Diversity, GNSS
LTE FDDB1/B3/B5/B7/B8/B20
InterfacesUSB 2.0, UART, PCM, GPIO
Operating Voltage3.3V - 4.3V
ProtocolsTCP/IP, UDP, FTP, HTTP, HTTPS
CertificationsCE, FCC, PTCRB, GCF, RCM, IC

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