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Quectel EC25 Hardware Design

Quectel EC25
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LTE Module Series
EC25 Mini PCIe Hardware Design
EC25_Mini_PCIe_Hardware_Design Confidential / Released 38 / 42
5 Dimensions and Packaging
5.1. General Description
This chapter mainly describes mechanical dimensions as well as packaging specification of EC25 Mini
PCIe module.
5.2. Mechanical Dimensions of EC25 Mini PCIe
Figure 15: Mechanical Dimensions of EC25 Mini PCIe (Unit: mm)
Quectel
Confidential

Table of Contents

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Quectel EC25 Specifications

General IconGeneral
CategoryLTE Module
LTE TDDB38/B40/B41
WCDMAB1/B5/B8
GSM850/900/1800/1900 MHz
Data ratesLTE Cat 4: 150 Mbps DL/50 Mbps UL
GNSSGPS/GLONASS/BeiDou/Galileo/QZSS
Operating Temperature-40°C to +85°C
Form FactorLCC
Storage Temperature-45°C to +90°C
SIM Interface1.8V/3.0V
Antenna InterfaceMain, Diversity, GNSS
LTE FDDB1/B3/B5/B7/B8/B20
InterfacesUSB 2.0, UART, PCM, GPIO
Operating Voltage3.3V - 4.3V
ProtocolsTCP/IP, UDP, FTP, HTTP, HTTPS
CertificationsCE, FCC, PTCRB, GCF, RCM, IC

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