Quectel EC25 Hardware Design

LTE Module Series
EC25 Mini PCIe Hardware Design
EC25_Mini_PCIe_Hardware_Design Confidential / Released 2 / 42
About the Document
History
Revision
Date
Author
Description
1.0
2016-06-07
Mountain ZHOU/
Frank WANG
Initial
1.1
2017-01-24
Lyndon LIU/
Frank WANG
1. Deleted description of EC25-AUT Mini PCIe
in Table 1.
2. Added description of EC25-AU and EC25-J
Mini PCIe in Table 1.
3. Updated key features of EC25 Mini PCIe in
Table 2.
4. Added current consumption in Chapter 4.7.
5. Updated conducted RF receiving sensitivity
of EC25-A Mini PCIe in Table 17.
6. Added conducted RF receiving sensitivity of
EC25-J Mini PCIe in Table 18.
Quectel
Confidential

Quectel EC25 Specifications

General

Category	LTE Module
LTE TDD	B38/B40/B41
WCDMA	B1/B5/B8
GSM	850/900/1800/1900 MHz
Data rates	LTE Cat 4: 150 Mbps DL/50 Mbps UL
GNSS	GPS/GLONASS/BeiDou/Galileo/QZSS
Operating Temperature	-40°C to +85°C
Form Factor	LCC
Storage Temperature	-45°C to +90°C
SIM Interface	1.8V/3.0V
Antenna Interface	Main, Diversity, GNSS
LTE FDD	B1/B3/B5/B7/B8/B20
Interfaces	USB 2.0, UART, PCM, GPIO
Operating Voltage	3.3V - 4.3V
Protocols	TCP/IP, UDP, FTP, HTTP, HTTPS
Certifications	CE, FCC, PTCRB, GCF, RCM, IC