Quectel SG368Z Series

Smart Module Series
SG368Z_Series_Hardware_Design 6 / 113
4.8.4. Audio Interfaces Design Considerations ...................................................................... 54
4.9. ADC Interfaces ..................................................................................................................... 55
4.10. Video Output Interfaces ........................................................................................................ 55
4.10.1. eDP Interface ........................................................................................................ 56
4.10.2. HDMI Interface ..................................................................................................... 58
4.10.3. LCM Interfaces ..................................................................................................... 61
4.11. Camera Interface .................................................................................................................. 63
4.11.1. MIPI Design Considerations ........................................................................................ 67
4.12. Touch Panel Interface ........................................................................................................... 69
4.13. PCIe Interfaces ..................................................................................................................... 69
4.14. RGMII Interfaces .................................................................................................................. 74
4.15. GPIO ..................................................................................................................................... 80
5 RF Specifications ............................................................................................................................ 83
5.1. Wi-Fi & Bluetooth .................................................................................................................. 83
5.1.1. Wi-Fi Overview ............................................................................................................ 83
5.1.2. Bluetooth Overview ...................................................................................................... 86
5.1.3. Reference Design ........................................................................................................ 87
5.2. RF Routing Guidelines .......................................................................................................... 87
5.3. Requirements for Antenna Design ........................................................................................ 89
5.4. RF Connector Recommendation .......................................................................................... 90
6 Electrical Characteristics and Reliability ...................................................................................... 92
6.1. Absolute Maximum Ratings .................................................................................................. 92
6.2. Power Supply Ratings .......................................................................................................... 92
6.3. Power Consumption ............................................................................................................. 93
6.4. Digital I/O Characteristics ..................................................................................................... 94
6.5. ESD Protection ..................................................................................................................... 96
6.6. Operating and Storage Temperatures ................................................................................... 97
7 Mechanical Information .................................................................................................................. 98
7.1. Mechanical Dimensions ........................................................................................................ 98
7.2. Recommended Footprint .................................................................................................... 100
7.3. Top and Bottom Views ........................................................................................................ 101
8 Storage, Manufacturing & Packaging .......................................................................................... 102
8.1. Storage Conditions ............................................................................................................. 102
8.2. Manufacturing and Soldering .............................................................................................. 103
8.3. Packaging Specification ...................................................................................................... 105
8.3.1. Carrier Tape ............................................................................................................... 105
8.3.2. Plastic Reel ................................................................................................................ 106
8.3.3. Mounting Direction ..................................................................................................... 106
8.3.4. Packaging Process .................................................................................................... 107
9 Appendix References ................................................................................................................... 108