Samsung BD-E8900 - Table of Contents

Contents
Contents
1.Precautions......................................................................................................................................1−1
1.1.SafetyPrecautions...................................................................................................................1−1
1.2.ServicingPrecautions...............................................................................................................1−3
1.2.1.GeneralServicingPrecautions.......................................................................................1−3
1.2.2.InsulationCheckingProcedure.......................................................................................1−3
1.3.ESDPrecautions......................................................................................................................1−4
1.4.Handlingtheopticalpick-up......................................................................................................1−5
2.ProductSpecications........................................................................................................................2−1
2.1.ProductSpecication................................................................................................................2−1
2.1.1.PlayerFeatures...........................................................................................................2−2
2.1.2.Blu-rayDiscFeatures...................................................................................................2−2
2.1.3.Disctypesandcontentsyourproductcanplay..................................................................2−3
2.1.4.HDDRecording..........................................................................................................2−4
2.1.5.Disctypesyourproductcannotplay................................................................................2−4
2.1.6.Regioncode...............................................................................................................2−4
2.1.7.SupportedFormats.......................................................................................................2−5
2.2.ChassisProductSpecication.....................................................................................................2−9
2.3.OptionProductSpecication......................................................................................................2−19
3.DisassemblyandReassembly..............................................................................................................3−1
3.1.CabinetandPCB.....................................................................................................................3−1
3.1.1.CoverP-TopRemoval..................................................................................................3−1
3.1.2.AssyFront-CabinetRemoval.........................................................................................3−2
3.1.3.AssyDeckRemoval.....................................................................................................3−3
3.1.4.AssyHDDRemoval....................................................................................................3−4
3.1.5.S.M.P.SPCBRemoval.................................................................................................3−5
3.1.6.FanRemoval..............................................................................................................3−6
3.1.7.MainPCB&Wi-FiModuleRemoval..............................................................................3−7
3.2.PCBLocation.........................................................................................................................3−8
4.Troubleshooting................................................................................................................................4−1
4.1.Troubleshooting......................................................................................................................4−2
4.2.SoftwareUpdate......................................................................................................................4−15
4.2.1.Upgrade.....................................................................................................................4−15
4.3.DeckAdjustment.....................................................................................................................4−18
5.PCBDiagrams..................................................................................................................................5−1
5.1.WiringDiagram.......................................................................................................................5−2
5.2.MainPCB..............................................................................................................................5−3
5.3.S.M.P.SPCB...........................................................................................................................5−5
5.4.FrontPCB..............................................................................................................................5−7
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