1.Precautions
1.3.ESDPrecautions
ElectrostaticallySensitiveDevices(ESD)
Somesemiconductor(solidstate)devicescanbedamagedeasilybystaticelectricity.
SuchcomponentscommonlyarecalledElectrostaticallySensitiveDevices(ESD).ExamplesoftypicalESDdevicesare
integratedcircuitsandsomeeld-effecttransistorsandsemiconductorchipcomponents.Thefollowingtechniquesshould
beusedtohelpreducetheincidenceofcomponentdamagecausedbystaticelectricity.
1)Immediatelybeforehandlinganysemiconductorcomponentorsemiconductor-equippedassembly,drainoffany
electrostaticchargeonyourbodybytouchingaknownearthground.Alternatively,obtainandwearacommercially
availabledischargingwriststrapdevice,whichshouldberemovedforpotentialshockreasonspriortoapplyingpower
totheunitundertest.
2)AfterremovinganelectricalassemblyequippedwithESDdevices,placetheassemblyonaconductivesurfacesuchas
aluminumfoil,topreventelectrostaticchargebuilduporexposureoftheassembly.
3)Useonlyagrounded-tipsolderingirontosolderorunsolderESDdevices.
4)Useonlyananti-staticsolderremovaldevices.Somesolderremovaldevicesnotclassiedas“anti-static”cangenerate
electricalchargessufcienttodamageESDdevices.
5)Donotusefreon-propelledchemicals.ThesecangenerateelectricalchargessufcienttodamageESDdevices.
6)DonotremoveareplacementESDdevicefromitsprotectivepackageuntilimmediatelybeforeinstallingit.(Most
replacementESDdevicesarepackagedwithleadselectricallyshortedtogetherbyconductivefoam,aluminumfoilor
comparableconductivematerials).
7)ImmediatelybeforeremovingtheprotectivematerialsfromtheleadsofareplacementESDdevice,touchtheprotective
materialtothechassisorcircuitassemblyintowhichthedevicewillbeinstalled.
CAUTION
Besurenopowerisappliedtothechassisorcircuit,andobserveallothersafetyprecautions.
8)MinimizebodymotionswhenhandlingunpackagedreplacementESDdevices.
(Otherwiseharmlessmotionssuchasthebrushingtogetherofyourclothesfabricortheliftingofyourfootfroma
carpetedoorcangeneratestaticelectricitysufcienttodamageanESDdevice).
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