Samsung OfficeServ 7070 - Table 2.6 BMP Specification

OfficeServ 7070 System Description/Ed.02OfficeServ 7070 System Description/Ed.02
© SAMSUNG Electronics Co., Ltd.
2-7
Option board
The BMP (MAIN part) has three (3) slots where option boards can be mounted.
A trunk board (PRM) or subscriber connection board (4DLM, 4SL2) is mounted into LOC1
(slot 1) and LOC2 (slot 2). A Modem board is mounted into LOC3 (slot 3).
Specification
The specification of BMP board is as follows:
Table 2.6 BMP Specification
Categories
Names
Standards
CPU
Processor
M82511 (Dual Core)
System Clock
375 MHz
Package
484 Ball FPBGA
SDRAM (For Program and Data)
Capacity
128 MB (32 MB × 4 EA)
Width of Data Bus
32 Bit
NAND (For Program, Db/Voice, Backup)
Capacity
1 GB (K9G8G08U0A)
Width of Data Bus
8 bit
Flash ROM (For Booting)
Capacity
0.5 MB (SST39VF040)
Width of Data Bus
8 bit
Time Switch
Device
STC9604
Basic Switch
256 × 256 Channel
Width of Data Bus
8 Bit
RTC
Device
RTC8564
Back UP Time
10 Days
Interface
I2C
EEPROM (Save IP/MAC Address)
Capacity
2 Kbit (AT24C02N)
Interface
I2C
LAN
Physical Layer
IEEE802.3
Speed
100Mbps Only
Port
1 EA
UART
Type
Async, 8Bit + 1Start + 1Stop
Speed
38.4Kbps
Etc.
External MOH Port
1 EA
External Broadcast
1 EA
Dry Contact
2 EA
Subscriber Port
DLI
4 Port
Option
LOC1
PRM, 4DLM, 4SL2
LOC2
4DLM, 4SL2
LOC3
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