Sennheiser HMEC 26 - Disassembly 3001; General 3001; Disassembly of the Headset

SENNHEISER ELECTRONIC GMBH & CO. KG
COMPONENT MAINTENANCE MANUAL
HMEC 26-SERIES
Page 3001
Jan 23/13
23-41-48
DISASSEMBLY
1. General
WARNING: OBEY ALL SAFETY INSTRUCTIONS WHEN YOU USE SOLDERING IRONS. FLUX FUMES CAN IRRITATE
YOUR EYES. DO NOT BREATHE THE FUMES. USE EXTRACTION DEVICES.
CAUTION:
FOR ALL SOLDERING PROCEDURES, ONLY USE ROHS COMPLIANT LEAD-FREE TIN-SOLDER TO
PREVENT EMBRITTLING OF SOLDER JOINTS.
MAKE SURE THAT THE SOLDERING TEMPERATURE OF THE SOLDERING IRON OBEYS THE SPECIFIED
MELTING RANGE. ALSO MAKE SURE THAT THE SOLDERING IRON IS POTENTIAL-FREE (PROTECTIVE
GROUNDING OR LOW-TENSION SUPPLY). PROTECTIVE VARNISHING AFTER SOLDERING IS ONLY
NECESSARY FOR UNITS THAT HAVE CONTACT WITH MOISTURE OR CONDENSATION. EXAMPLES
ARE THE MICROPHONE AND OTHER RECORDING EQUIPMENT.
CAUTION:
OBEY ALL ESD SAFETY PRECAUTIONS WHEN YOU HANDLE ELECTROSTATIC SENSITIVE PARTS.
NOTE:
The procedure that follows is applicable to all Headsets of the HMEC 26 headset series and also to
the two headphone cap sides. For cross-references to illustrations made in this chapter,
refer to the IPL.
2. Disassembly of the Headset
A. Removal of the Cable
NOTE:
THIS PROCEDURE IS NOT APPLICABLE FOR HEADSETS WITHOUT A CABLE.
NOTE:
FOR HMEC 26, REFER TO IPL FIG. 1 AND FOR HMEC 26-T, REFER TO IPL FIG. 3.
FOR THE TWO HEADSETS, REFER TO IPL FIG. 17.
(1) Loosen the screws (010) from the system connector at the headphone cap on the
microphone side (070).
(2) Remove the Cable (110) from the headphone cap (070).
B. Removal of the earpads
NOTE:
FOR HMEC 26, REFER TO IPL FIG. 1 AND FOR HMEC 26-T, REFER TO IPL FIG. 3.
NOTE:
FOR ACOUSTICAL REASONS ALWAYS REPLACE THE LEFT AND THE RIGHT EARPAD.
(1) Grasp the edge of the earpad (100) and pull sharply
Figure 3000
Removal of the earpads
Feb 10/10
Disassem-
bly