Sony CDP-400 - Page 33

|
CDP-400/501/S5O1ES/610ES
CDP-400/501/501ES/610ES.
|
1c701
®
When
replacing
IC412,1C521
and
1C621
first
clean
IC
oe
the
IC
head
and
the
inside
of
the
heat
sink
with
Q
alcohol,
then
mount
the
heat
sink
and
fill
the
heat
sink
indented
portion
with
an
epoxy
type
‘
adhesive*, as shown in the illustration below.
To SERVO AMP SECTION
582
581
621
\c62!
1C623
ee
2e2
1¢503
ie80s
Ic7H
ic522
IcS2i
1C523
402,
10502
ass
i501
1C401
me
ic761
76
ic404
at
1403
1C402
Tid
i¢702
764
763
5
ica
405
405
ett
2g
791!
22S
see
622
621
401
B4y
PHP
fi
i
if
408
pple
PP
an]
Pout
fae
f
yer
758
es
C06
762
761
402
403
|
he
teste
pyre
d
/
aos
|
iz
|
LG
Lg
ob
409
|
707
705
756
\
*
Epoxy
type
adhesive:
Sony
bond
SC1000
or
other
Qe
1-156
34)
quick
drying
2
liquid
compound.
epoxy adhesive
insert
more
than
4.
IC
heat sink
@ When replacing IC523 and IC623 secure them
7 HEAT SINK
Fey é
Loy
oH
uw
S~il-16 >
so that leads of IC do not touch dip heat sink
(upper, lower) by quick set adhesive.
Apply
a
quick
set
adhesive
to
the
under
surface.
;
DIP
heat
sink
(upper)
Cut out portion.
Assemble
by
matching
up
the
section
of
the
IC
TO
SERVO
AMP
SECTION
CN22
38
marked
*
and
the
cut-out
portion
of
the
DIP
Qa
te
~
6-38
>
heat
sink
(upper).
8-14-36)
a B44 BE ~ 42)
8
Sa
CRE
me
||
ii Bae ee ~