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Sony CDX-M50IP - Product Classification and Component Handling; Class 1 Laser Product Label; Chip Component Replacement Notes; Test Discs for CD Section

Sony CDX-M50IP
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3
CDX-M50IP/MR50IP
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
This label is located on the bottom of the chassis.
This compact disc player is classified as a CLASS 1 LASER
product. The CLASS 1 LASER PRODUCT label is located on the
exterior.
• CDX-MR50IP
Notes on Chip Component Replacement
•Never reuse a disconnected chip component.
Notice that the minus side of a tantalum capacitor may be damaged
by heat.
TEST DISCS
Please use the following test discs for the check on the CD section.
YDES-18 (Part No. 3-702-101-01)
PATD-012 (Part No. 4-225-203-01)
CD playback
You can play CD-DA (also containing CD TEXT) and CD-R/
CD-RW (MP3/WMA/AAC files).
Type of discs Label on the disc
CD-DA
MP3
WMA
AAC

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