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Technical details on system, laser, recording, playback, response, and inputs/outputs.
Information on power requirements, battery life, dimensions, and mass.
List of included accessories.
Guidelines for safe handling of the optical pick-up and laser diode.
Notes on flexible circuit board repair and chip component replacement.
Description of all controls for the recorder, display window, and remote headphones.
Steps for disassembling bottom and upper panel assemblies.
Procedures for removing LCD module, main board, and associated assemblies.
Disassembly of chassis, mechanism deck, service assemblies, holder, motor boards, and DC motors.
Methods for entering, operating, and exiting test mode.
Overview of test mode configurations and detailed Manual Mode operation.
Procedures for Overall Adjustment, Sound Skip Check, and Self-Diagnosis.
Procedure for verifying the functionality of all unit and remote controls.
Safety guidelines, tools, and the overall sequence for electrical adjustments.
NV reset, power supply adjustment, and temperature correction procedures.
Automatic CD/MO adjustments and laser power checks.
System block diagrams illustrating signal paths and functional blocks.
Printed wiring board layouts and detailed circuit schematics.
Detailed pin assignments and functions for key integrated circuits.
Exploded views of panel assemblies and the main chassis.
Detailed exploded view of the MD mechanism deck and its components.
Comprehensive list of all electrical components, part numbers, and descriptions.
Details regarding the addition of the Korean model variant.
Information on corrections to exploded views and parts lists.