Tektronix TM 504 User Manual

System Maintenance—
TM
504
Replacement semiconductors
should
be
of
the original
type
or
a
direct
replacement. Figure
2
shows the lead
configuration
of the semiconductors
used in this
instrument
system. When removing
soldered-in transistors,
use
a
suction-type
de-soldering
tool
to
remove the
solder from
the holes in the
circuit board.
An
extracting
tool
should
be used
to remove the
14-
and
16-pin
integrated circuits
to
prevent
damage to the pins.
This
tool is available from
Tektronix, Inc.
Order Tektronix
Part
No.
003-0619-00.
If
an extracting
tool is not
available,
use care
to
avoid damaging the pins. Pull
slowly
and
evenly
on both
ends of the
1C.
Try
to avoid having
one
end of
the
1C
disengage
from
the
socket
before
the
other
end.
To
replace
one
of
the
power
transistors
mounted
on the
Power
Module chassis
adjacent
to
the
interface
circuit
board,
first
unsolder the
leads. Then,
loosen
the nuts
which
clamp the
transistor
to
the
chassis.
Remove
the defective
transistor.
When replacing
the
transistor,
use
a
mica
washer
on the
metal tab
to Increase
heat
transfer
from the
transistor
to
the
chassis.
fl
C
1
E
B
C
C
C
B
E
Plastic-Cased
T
ransistors
ft
c'lL
E
E
Metal-Cased
T
ransistors
S
S
V/?
a a)
FET's
See
manufacturer's
specification
sheets
Power
Transistors
SCR
Case
Ground
(Output)
j
j
Pin
1
I
•
(Input)
/
Pin
1
(Input)
Pin
2
(Output)
Pin
3
(Ground)
Regulator
IC's
Heat
dissipator
(may
be applied
to
some
metal-
cased
transistors)
Integrated
Circuits
Fig.
2.
Semiconductor
device
lead configurations
found
in the
TM 500
family.
REV.
B,
SEPT. 1975
12

Tektronix TM 504 Specifications

General

Brand	Tektronix
Model	TM 504
Category	Control Unit
Language	English