BlueMod+S50 Hardware User Guide
1VV0301505 Rev. 1 Page 34 of 53 2018-03-02
Re-flow Temperature-Time Profile
The data here is given only for guidance on solder and has to be adapted to your process
and other re-flow parameters for example the used solder paste. The paste manufacturer
provides a re-flow profile recommendation for his product.
Figure 22: Soldering Temperature-Time Profile (For Reflow Soldering)
tsmax tLmax tpmax
Temperature Time Temperature Time Temperature Time
[°C] [sec] [°C] [sec] [°C] [sec]
150
100
217 90
260
10
230 50
Average ramp-up rate [°C / sec] 3
Average ramp-down rate [°C / sec] 6
Max. Time 25°C to Peak
Temperature
[min.] 8
Opposite side reflow is prohibited due to module weight.
Devices will withstand the specified profile and will withstand up to one re-flows to a
maximum temperature of 260°C. The reflow soldering profile may only be applied if the
BlueMod+S50 resides on the PCB side looking up. Heat above the solder eutectic point
while the BlueMod+S50 is mounted facing down may damage the module permanently.
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