Telit Wireless Solutions GE910 - Page 6

GE910 Hardware User Guide
1vv0300962 Rev.12 2013-10-22
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 6 of 83
Mod. 0805 2011-07 Rev.2
7.4.9. Powering the External LNA (active antenna) ................................................................................................ 46
7.4.10. External LNA Enable ..................................................................................................................................... 47
8. Logic Level Specifications ............................................................................................................................................ 48
9. USB Port ........................................................................................................................................................................ 49
9.1. USB 2.0 FS ............................................................................................................................................................ 49
10. Serial Ports ................................................................................................................................................................ 50
10.1. Modem Serial Port ................................................................................................................................................. 50
10.2. RS232 level translation .......................................................................................................................................... 52
11. Audio Section Overview ........................................................................................................................................... 54
11.1. Digital Voice Interface (DVI) ................................................................................................................................ 54
11.1.1. DVI Electrical Connections ........................................................................................................................... 54
11.2. Analog Front-End ................................................................................................................................................... 54
11.2.1. MIC connection ............................................................................................................................................. 54
11.2.2. LINE-IN connection ....................................................................................................................................... 56
11.2.3. EAR connection ............................................................................................................................................. 57
11.2.4. Electrical Characteristics .............................................................................................................................. 59
12. General Purpose I/O ................................................................................................................................................. 61
12.1. Using a GPIO Pad as INPUT ................................................................................................................................. 62
12.2. Using a GPIO Pad as OUTPUT ............................................................................................................................. 62
12.3. Indication of network service availability .............................................................................................................. 63
12.4. RTC Bypass out ..................................................................................................................................................... 64
12.5. External SIM Holder Implementation .................................................................................................................... 64
12.6. ADC Converter ...................................................................................................................................................... 64
12.6.1. Description .................................................................................................................................................... 64
12.6.2. Using ADC Converter ................................................................................................................................... 64
13. Mounting the GE910 on your Board....................................................................................................................... 65
13.1. General ................................................................................................................................................................... 65
13.2. Module finishing & dimensions ............................................................................................................................. 65
13.3. Recommended foot print for the application .......................................................................................................... 66
13.4. Stencil ..................................................................................................................................................................... 67
13.5. PCB pad design ...................................................................................................................................................... 67
13.6. Recommendations for PCB pad dimensions .......................................................................................................... 67
13.7. Solder paste ............................................................................................................................................................ 69
13.7.1. GE910 Solder reflow ..................................................................................................................................... 69
14. Packing system .......................................................................................................................................................... 71
14.1. Packing on Reel ...................................................................................................................................................... 71
14.1.1. Carrier Tape Detail ....................................................................................................................................... 71
14.1.2. Reel Detail ..................................................................................................................................................... 72
14.1.3. Packaging Detail ........................................................................................................................................... 73
14.2. Packing on tray ....................................................................................................................................................... 74
14.3. Moisture sensibility ................................................................................................................................................ 76
15. Conformity Assessment Issues ................................................................................................................................. 77
16. SAFETY RECOMMANDATIONS ......................................................................................................................... 82
17. Document History ..................................................................................................................................................... 83