Telit Wireless Solutions GE910 - Solder Paste; GE910 Solder Reflow

GE910 Hardware User Guide
1vv0300962 Rev.12 2013-10-22
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 69 of 83
Mod. 0805 2011-07 Rev.2
13.7. Solder paste
Lead free
Solder paste
Sn/Ag/Cu
We recommend using only “no clean” solder paste in order to avoid the cleaning of the
modules after assembly.
13.7.1. GE910 Solder reflow
Recommended solder reflow profile
TL
Tsmin
Tsmax
ts
tL
tp
ttp