13 Device and Documentation Support
13.1 Device Support
13.1.1 Development Support
For the IBIS Model, see TPS65982ZQZR IBIS Model (SLVMAY7)
13.2 Documentation Support
13.2.1 Related Documentation
For related documentation, see the following:
• USB Power Delivery Specification, Revision 2.0, Version 1.2 (March 25th, 2016)
• USB Type-C Specification, Revision 1.2 (March 25th, 2016)
• USB Battery Charging Specification, Revision 1.2 (December 7th, 2010)
• TPS65981, TPS65982, and TPS65986 Firmware User’s Guide (SLVUAH7)
• TPS65981, TPS65982, and TPS65986 Host Interface Technical Reference Manual (SLVUAN1)
• W25Q80DV data sheet, 8M-Bit, 16M-Bit and 32M-Bit Serial Flash Memory With Dual and Quad SPI
• NSR20F30NXT5G data sheet, Schottky Barrier Diode
13.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
13.4 Support Resources
TI E2E
™
support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
13.5 Trademarks
TI E2E
™
is a trademark of Texas Instruments.
USB Type-C
®
is a registered trademark of USB Implementers Forum.
All trademarks are the property of their respective owners.
13.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
13.7 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
14 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
TPS65982
SLVSD02E – MARCH 2015 – REVISED AUGUST 2021
www.ti.com
110 Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Product Folder Links: TPS65982
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