Table of Contents
1 Features............................................................................1
2 Applications..................................................................... 1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Description (continued).................................................. 4
6 Pin Configuration and Functions...................................5
7 Specifications................................................................ 11
7.1 Absolute Maximum Ratings...................................... 11
7.2 ESD Ratings..............................................................11
7.3 Recommended Operating Conditions.......................12
7.4 Thermal Information..................................................12
7.5 Power Supply Requirements and Characteristics.....13
7.6 Power Supervisor Characteristics.............................14
7.7 Power Consumption Characteristics
(4)
.................... 14
7.8 Cable Detection Characteristics................................15
7.9 USB-PD Baseband Signal Requirements and
Characteristics.............................................................16
7.10 USB-PD TX Driver Voltage Adjustment
Parameter....................................................................16
7.11 Port Power Switch Characteristics.......................... 17
7.12 Port Data Multiplexer Switching Characteristics..... 20
7.13 Port Data Multiplexer Clamp Characteristics.......... 22
7.14 Port Data Multiplexer SBU Detection
Characteristics.............................................................22
7.15 Port Data Multiplexer Signal Monitoring Pullup
and Pulldown Characteristics...................................... 22
7.16 Port Data Multiplexer USB Endpoint
Characteristics.............................................................22
7.17 Port Data Multiplexer BC1.2 Detection
Characteristics.............................................................23
7.18 Analog-to-Digital Converter (ADC)
Characteristics.............................................................23
7.19 Input/Output (I/O) Characteristics........................... 24
7.20 I
2
C Slave Characteristics........................................ 26
7.21 SPI Controller Characteristics.................................27
7.22 BUSPOWERZ Configuration Characteristics..........27
7.23 Thermal Shutdown Characteristics......................... 28
7.24 Oscillator Characteristics........................................ 28
7.25 Single-Wire Debugger (SWD) Timing
Requirements.............................................................. 28
7.26 HPD Timing Requirements..................................... 28
7.27 Typical Characteristics............................................ 29
8 Parameter Measurement Information.......................... 30
9 Detailed Description......................................................32
9.1 Overview................................................................... 32
9.2 Functional Block Diagram......................................... 33
9.3 Feature Description...................................................33
9.4 Device Functional Modes..........................................70
9.5 Programming............................................................ 76
10 Application and Implementation................................ 81
10.1 Application Information........................................... 81
10.2 Typical Applications................................................ 81
11 Power Supply Recommendations..............................90
11.1 3.3-V Power............................................................ 90
11.2 1.8 V Core Power....................................................90
11.3 VDDIO.....................................................................90
12 Layout...........................................................................92
12.1 Layout Guidelines................................................... 92
12.2 Layout Example...................................................... 96
13 Device and Documentation Support........................110
13.1 Device Support......................................................110
13.2 Documentation Support........................................ 110
13.3 Receiving Notification of Documentation Updates 110
13.4 Support Resources............................................... 110
13.5 Trademarks........................................................... 110
13.6 Electrostatic Discharge Caution............................ 110
13.7 Glossary................................................................ 110
14 Mechanical, Packaging, and Orderable
Information.................................................................. 110
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (June 2019) to Revision E (August 2021) Page
• Updated the numbering format for tables, figures and cross-references throughout the document ..................1
• Globally changed instances of legacy terminology to controller and peripheral where SPI is mentioned.......... 1
• Updated the Features list....................................................................................................................................1
• Updated the Applications section....................................................................................................................... 1
Changes from Revision C (August 2016) to Revision D (June 2019) Page
• Added NFBGA package to the Device Information table....................................................................................1
• Added NFBGA package to the Pin Configuration and Functions section...........................................................5
• Added NFBGA package to the Thermal Information table............................................................................... 12
Changes from Revision B (May 2016) to Revision C (August 2016) Page
• Added the HRESET I/O voltage parameter to the Absolute Maximum Ratings table.......................................11
• Changed the value for the HBM from ±2000 to ±1500 in the ESD Ratings table............................................. 11
TPS65982
SLVSD02E – MARCH 2015 – REVISED AUGUST 2021
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