Ublox SARA-G450 Series User Manual

SARA-G450 - System integration manual
UBX-18046432 - R08 Design-in Page 114 of 143
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2.11 Module footprint and paste mask
Figure 72 and Table 46 describe the suggested footprint (i.e. copper mask) and paste mask layout for
SARA modules: the proposed land pattern layout reflects the modules’ pins layout, while the proposed
stencil apertures layout is slightly different (see the F’’, H’’, I’’, J’’, O’’ parameters compared to the F’,
H’, I’, J’, O’ ones).
Non Solder Mask Defined (NSMD) pad type is recommended over Solder Mask Defined (SMD) pad
type, implementing the solder resist mask opening 50 m larger per side than corresponding copper
pad.
The recommended thickness of the stencil for the soldering paste is 150 m, according to application
production process requirements.
K
M1
M1
M2
E G H’ J’ E
ANT pin
B
Pin 1
K
G
H’
J’
A
D
D
O’
O’
L N L
I’
F’
F’
K
M1
M1
M2
E G H’’ J’’ E
ANT pin
B
Pin 1
K
G
H’’
J’’
A
D
D
O’’
O’’
L N L
I’’
F’’
F’’
Stencil: 150
µm
Figure 72: SARA-G450 modules suggested footprint and paste mask (application board top view)
Parameter
Value
Parameter
Value
Parameter
Value
A
26.0 mm
G
1.10 mm
K
2.75 mm
B
16.0 mm
H’
0.80 mm
L
2.75 mm
C
3.00 mm
H’’
0.75 mm
M1
1.80 mm
D
2.00 mm
I’
1.50 mm
M2
3.60 mm
E
2.50 mm
I’’
1.55 mm
N
2.10 mm
F’
1.05 mm
J’
0.30 mm
O’
1.10 mm
F’’
1.00 mm
J’’
0.35 mm
O’’
1.05 mm
Table 46: SARA-G450 modules suggested footprint and paste mask dimensions
☞ These are recommendations only and not specifications. The exact copper, solder and paste mask
geometries, distances, stencil thicknesses and solder paste volumes must be adapted to the
specific production processes (e.g. soldering etc.) of the customer.

Ublox SARA-G450 Series Specifications

General

Brand	Ublox
Model	SARA-G450 Series
Category	GSM/GPRS Modules
Language	English