ViewSonic PJD5122 - Page 34

7. Assembly OP ENG
7.1 Assemble “Baffle DMD” to “HSG DMD” (Fig.7-1).
7.2 Assemble “Sponge DMD” to “HSG DMD” (Fig.7-1).
7.3 Assemble Chip B/D Module to “HSG DMD” (Fig. 7-2).
Fig.7-1
Fig.7-2-1
Baffle DMD
Sponge DMD
Alignment keying
Fixed shafts of
DMD HSG
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PJD5122
ViewSonic Corporation
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