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General| Build Volume | 500 x 500 x 500 mm |
|---|---|
| Nozzle Diameter | 0.4 mm |
| Filament Diameter | 1.75 mm |
| Connectivity | USB, SD Card |
| Frame Material | Aluminum |
| Bed Temperature | up to 100°C |
| Nozzle Temperature | up to 260°C |
| Heated Bed | Yes |
| Supported Materials | PLA, ABS, PETG, TPU |
| Display | Touch Screen |
| Print Technology | Fused Deposition Modeling (FDM) |
| Power Supply | 110V/220V |
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