Need help?Do you have a question about the WANHAO I3 Plus and is the answer not in the manual?
General| Build Volume | 200 x 200 x 180 mm |
|---|---|
| Layer Resolution | 0.1 - 0.4 mm |
| Filament Diameter | 1.75 mm |
| Nozzle Diameter | 0.4 mm |
| Connectivity | USB, SD Card |
| Supported Materials | PLA, ABS, PETG, TPU |
| Frame Material | Steel |
| Heated Bed | Yes |
| Bed Temperature | Up to 100°C |
| Nozzle Temperature | Up to 260 °C |
| Display | LCD |
| Technology | FDM (Fused Deposition Modeling) |
To Next Page
