1. INTRODUCTION
cept, the user can check diagnostic information of any mod-
ule present in the system directly on CPU’s graphic display
with one single press in the diagnostic switch of the respective
module. OTD is a powerful diagnostic tool that can be used
offline (without supervisor or programmer), reducing mainte-
nance and commissioning times.
OFD – On Board Full Documentation: Nexto Series CPUs are capable of storing the complete project documentation in
its own memory. This feature can be very convenient for backup purposes and maintenance, since the complete information is
stored in a single and reliable place.
ETD – Electronic Tag on Display: Another exclusive feature that Nexto Series brings to PLCs is the Electronic Tag on
Display. This new functionality brings the process of checking the tag names of any I/O pin or module used in the system
directly to the CPU’s graphic display. Along with this information, the user can check the description, as well. This feature is
extremely useful during maintenance and troubleshooting procedures.
DHW – Double Hardware Width: Nexto Series modules were designed to save space in user cabinets or machines.
For this reason, Nexto Series delivers two different module widths: Double Width (two backplane rack slots are required)
and Single Width (only one backplane rack slot is required). This concept allows the use of compact I/O modules with a
high-density of I/O points along with complex modules, like CPUs, fieldbus masters and power supply modules.
UCP de Alta Velocidade: All Nexto Series CPUs were designed to provide an outstanding performance to the user, allow-
ing the coverage of a large range of applications requirements. For example: Nexto CPUs can execute a sum, multiplication
and subtraction instruction in less than 15 ns for integer type values and in less than 23 ns for real type values. Nexto CPUs
are able to perform 1,000 PID loops in less than 5 ms.
iF Product Design Award 2012: Nexto Series was the
winner of iF Product Design Award 2012 in industry + skilled
trades group. This award is recognized internationally as a
seal of quality and excellence, considered the Oscars of the
design in Europe.
1.1.3. Architecture
Nexto Series is capable of addressing many different applications ranging from small high-speed machinery automation to
large complex process automation. For this reason, the system is very flexible and modular enabling many different configura-
tions without compromising cost and performance.
The modules Nexto and Nexto Jet cannot be used together in the same bus, it means that, the usage of mixed modules in
the same bus local/remote is not valid, consequently the application will not be executed by the chosen CPU.
The architecture is divided in the following main components:
1.1.3.1. CPU
The CPU is responsible for the execution of all logic and control functions. The basic CPU cycle is composed by: reading
inputs, running application algorithms and logic, writing outputs and providing communication processes with the supervision
system and fieldbus networks.
1.1.3.2. Power Supply Module (PSU)
The power supply module provides power to the modules installed on the backplane racks. Each rack must have its own
power supply module. Application power requirements are shown in the configuration tool.
1.1.3.3. Backplane Bus
A typical system consists of a local rack (CPU and its local I/O modules) and remote racks (sets of remote I/O modules).
For the local rack, Nexto Series architecture delivers a state-of-the-art high-speed real-time 100 Mbps Ethernet backplane bus
technology. Since it is Ethernet based, the local rack bus can be easily extended to remote racks using standard Ethernet
cables (up to 100 m) and devices called bus expansion modules. These devices convert the internal signals to the standard
Ethernet 100BASE-TX media. Bus expansions can be used in redundant mode to obtain an extremely reliable architecture.
Each backplane rack can have up to 24 modules and the system can address up to 25 racks.
1.1.3.4. Backplane Racks
The backplane racks have special aluminum chassis with a printed circuit board where all modules are connected. They
are assembled directly to the panel and deliver high immunity against EMI and ESD (if the recommended grounding rules are
performed during installation phase).
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