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General| Build Volume | 350 x 350 x 400 mm |
|---|---|
| Layer Resolution | 0.1 - 0.4 mm |
| Nozzle Diameter | 0.4 mm |
| Filament Diameter | 1.75 mm |
| Connectivity | SD card, USB |
| Frame Material | Aluminum |
| Bed Temperature | up to 110°C |
| Nozzle Temperature | up to 260°C |
| File Format | STL, OBJ, AMF |
| Print Technology | FDM (Fused Deposition Modeling) |
| Machine Weight | 18.2 kg |
| Supported Filaments | PLA, ABS, TPU |
| Touch Screen | Yes |
| Input Voltage | AC 100-240V |
| Motherboard | V2.2 |
| Bed Leveling | Automatic Bed Leveling (BL Touch) |
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