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Build Volume | 350 x 350 x 400 mm |
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Layer Resolution | 0.1 - 0.4 mm |
Nozzle Diameter | 0.4 mm |
Filament Diameter | 1.75 mm |
Connectivity | SD card, USB |
Frame Material | Aluminum |
Bed Temperature | up to 110°C |
Nozzle Temperature | up to 260°C |
File Format | STL, OBJ, AMF |
Print Technology | FDM (Fused Deposition Modeling) |
Machine Weight | 18.2 kg |
Supported Filaments | PLA, ABS, TPU |
Touch Screen | Yes |
Input Voltage | AC 100-240V |
Motherboard | V2.2 |
Bed Leveling | Automatic Bed Leveling (BL Touch) |