Service Manual
2
Table of Contents
CHAPTER 1- PRECAUTIONS & SAFETY NOTICES.....................................................................................................................
0
H3
1. SAFETY PRECAUTIONS ....................................................................................................................................................
1
H3
2. PRODUCT SAFETY NOTICE ..............................................................................................................................................
2
H3
3. SERVICE NOTES..................................................................................................................................................................
3
H3
CHAPTER 2- SERVICE TOOLS & EQUIPMENT REQUIRED .....................................................................................................
4
H4
CHAPTER 3- CIRCUIT THEORY ......................................................................................................................................................
5
H5
1. BLOCK DIAGRAM ...................................................................................................................................................................
6
H5
2. ELECTRONIC CIRCUIT THEORY ...............................................................................................................................................
7
H5
3. FACTORY PRESET TIMING TABLE ................................................................................................................................
8
H11
4. POWER ON/OFF SEQUENCY ..................................................................................................................................................
9
H11
5. D-SUB CONNECTOR PIN ASSIGNMENT................................................................................................................................. 12
6. AC OUTLET PIN ASSIGNMENT .............................................................................................................................................. 12
7. INNER CONNECTOR PIN ASSIGNMENT...................................................................................................................................
10
H13
8. KEY PARTS PIN ASSIGNMENTS .............................................................................................................................................. 14
CHAPTER 4- DISASSEMBLY & ASSEMBLY.................................................................................................................................
11
H18
1. EXPLODED DIAGRAM ...........................................................................................................................................................
12
H18
2. E190SF DISASSEMBLY BLOCK.............................................................................................................................................. 19
3. ASSEMBLY BLOCK ................................................................................................................................................................ 20
CHAPTER 5- TEST AND ADJUSTMENT........................................................................................................................................ 21
1. FUNCTION KEY DEFINITIONS ................................................................................................................................................
13
H21
2. OSD CONTROL ...................................................................................................................................錯誤! 尚未定義書籤。
3. FACTORY MODE INTRODUCTION...........................................................................................................................................
14
H22
4. BURN-IN PATTERN.................................................................................................................................................................
15
H22
5. AUTO COLOR BALANCE (AUTOMATICALLY CALIBRATE CHIP ADC PARAMETER BY USING CHIP INTERNAL DAC.)................
16
H22
6. EDID (REWRITE EDID DATA TO EEPROM).........................................................................................................................
17
H23
7. UPLOAD FIRMWARE TO MCU VIA VGA CABLE ....................................................................................................................
18
H23
8. AFTER REPAIR, TO ENSURE THE QUALITY YOU SHOULD DO THE FOLLOWING TEST AND ADJUSTMENT. ...................................
19
H25
CHAPTER 6- TROUBLE SHOOTING..............................................................................................................................................
20
H25
1. COMMON ACKNOWLEDGE ....................................................................................................................................................
21
H25
2. NO POWER & POWER LED OFF............................................................................................................................................
22
H26
3. POWER LED AMBER.............................................................................................................................................................
23
H26
4. BACKLIGHT CAN’T BE TURNED ON........................................................................................................................................ 27
5. NO PICTURE & BACKLIGHT ON .............................................................................................................................................
24
H29
6. AT 32-GRAY SCALE PATTERN, COLOR LOST IN SOME SCALE ................................................................................................... 29
7.
DIAGNOSTIC TEST PAT TE RN .................................................................................................................................................. 29
CHAPTER 7- RECOMMENDED PART LIST ................................................................................................................................. 32
ATTACHMENT 1- BILL OF MATERIAL.........................................................................................................................................
25
H34
ATTACHMENT 2- SCHEMATIC.......................................................................................................................................................
26
H44
ATTACHMENT 3- PCB LAYOUT..................................................................................................................................................... 54