2
CONTENTS
SAFETY PRECAUTIONS
..........................................................3
NOTE FOR SCHEMATIC DIAGRAM
.........................................4
TECHNICAL SPECIFICATIONS
................................................5
DIMENSION
...............................................................................5
DISASSEMBLY
..........................................................................6
SPECIAL MODE
......................................................................12
1. Special mode setting ...........................................................12
2. Version Up mode .................................................................12
3. Version indicate mode .........................................................13
4. Adjusting mode of the touch sense sensitivity .....................14
5. Initialization of parameters ..................................................14
6. Adjusting interval time of MIDI command transmission .......15
7. SW, VOLUME, ENCODER and LED TEST .........................16
WHEN THE MICROPROCESSOR IS
REPLACED WITH A NEW ONE
..............................................23
PROCEDURE
FOR UPGRADING
THE VERSION OF THE FIRMWARE
......................................23
TROUBLE SHOOTING
............................................................32
WIRING DIAGRAM
..................................................................41
BLOCK DIAGRAM
...................................................................43
POWER BLOCK DIAGRAM
....................................................44
Level DIAGRAM
......................................................................45
PRINTED WIRING BOARDS
...................................................46
CONTROL ..............................................................................46
I/O ..........................................................................................48
SCHEMATIC DIAGRAMS (1/2)
...............................................50
CONTROL UNIT .....................................................................50
I/O UNIT ..................................................................................51
EXPLODED VIEW
....................................................................52
PARTS LIST OF EXPLODED VIEW
........................................53
PACKING VIEW
.......................................................................55
PARTS LIST OF PACKING & ACCESSORIES
.......................55
SEMICONDUCTORS
...............................................................57
1. IC's ......................................................................................57
PARTS LIST OF P.C.B. UNIT
..................................................68
CONTROL P.C.B ASS'Y ..........................................................68
I/O P.C.B ASS'Y.......................................................................71
CROS FADER P.C.B ASS'Y ....................................................75
PHONE P.C.B ASS'Y...............................................................75