FLIR Blackfly S - 5.9 Case Temperature and Heat Dissipation

5 BlackflyS Physical Interface
5.9 Case Temperature and Heat Dissipation
You must provide sufficient heat dissipation to control the internal operating temperature of the camera.
The camera is equipped with an on-board temperature sensor.
n For cased models—It allows you to obtain the temperature of the camera board-level components. The sensor
measures the ambient temperature within the case.
n For board-level models—It allows you to obtain the temperature of the camera FPGA junction temperature. The
temperature must be kept under 100°C. Some models may not require heat sinking depending on the mode of
operation.
As a result of packing the camera electronics into a small space, the camera can become hot to the touch
when running. For cased models, this is expected behavior and will not damage the camera electronics. For
board-level models, the temperature must be kept under 100°C and therefore may require a heat sink to
avoid damage.
To reduce heat, use a cooling fan to set up a positive air flow around the camera, taking into consideration the following
precautions:
n Mount the camera on a heat sink, such as a camera mounting bracket, made out of a heat-conductive material
like aluminum. When designing a heat sink for a board-level model, respect the Keepout Layer—Board-level
Models.
n Make sure the flow of heat from the camera to the bracket is not blocked by a non-conductive material like
plastic.
n Make sure the camera has enough open space around it to facilitate the free flow of air.
To access temperature information:
n Query the GenICam Device Control feature DeviceTemperature.
For board-level models—Device temperature can be monitored in SpinView as follows:
n Select Device_Temperature_Selector Enum Node
n Set Device_Temperature_Selector Enum Node Value to Mainboard
n Read Device_Temperature Node
2/19/2019
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FLIR Blackfly
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S Installation Guide 27