FLIR Blackfly S - 5.9 Case Temperature and Heat Dissipation

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5 BlackflyS Physical Interface

5.9 Case Temperature and Heat Dissipation

You must provide sufficient heat dissipation to control the internal operating temperature of the camera.

The camera is equipped with an on-board temperature sensor.

n For cased models—It allows you to obtain the temperature of the camera board-level components. The sensor

measures the ambient temperature within the case.

n For board-level models—It allows you to obtain the temperature of the camera FPGA junction temperature. The

temperature must be kept under 100°C. Some models may not require heat sinking depending on the mode of

operation.

As a result of packing the camera electronics into a small space, the camera can become hot to the touch

when running. For cased models, this is expected behavior and will not damage the camera electronics. For

board-level models, the temperature must be kept under 100°C and therefore may require a heat sink to

avoid damage.

To reduce heat, use a cooling fan to set up a positive air flow around the camera, taking into consideration the following

precautions:

n Mount the camera on a heat sink, such as a camera mounting bracket, made out of a heat-conductive material

like aluminum. When designing a heat sink for a board-level model, respect the Keepout Layer—Board-level

Models.

n Make sure the flow of heat from the camera to the bracket is not blocked by a non-conductive material like

plastic.

n Make sure the camera has enough open space around it to facilitate the free flow of air.

To access temperature information:

n Query the GenICam Device Control feature DeviceTemperature.

For board-level models—Device temperature can be monitored in SpinView as follows:

n Select Device_Temperature_Selector Enum Node

n Set Device_Temperature_Selector Enum Node Value to Mainboard

n Read Device_Temperature Node

2/19/2019

Integrated Imaging

Solutions Inc.

FLIR Blackfly

S Installation Guide 27