Frye FONIX 8000 - Default Chapter; Table of Contents

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Contents
Chapter 1: Overview ............................................................1
1.1 Signal Generation Overview ...............................................................1
1.1.1 Digital Basis of the Composite Signal .................................................1
1.1.2 Component Amplitude Weighting Considerations ...................................1
1.1.3 Phase of the Components............................................................2
1.1.4 Special Distortion Measurements ....................................................2
1.2 Signal Detection Overview .................................................................2
1.2.1 Fast Fourier Technique...............................................................2
Chapter 2: Specifications ........................................................5
2.1 Acoustical Outputs .........................................................................5
2.2 Telecoil Outputs ...........................................................................5
2.3 Battery Current.............................................................................5
2.4 Digital Readout of Sound Pressure Level ...................................................6
2.5 Harmonic Distortion Analyzer .............................................................6
2.6 Attack/Release.............................................................................6
2.7 Available Tests .............................................................................6
2.8 Power ......................................................................................6
2.9 Electronics Module ........................................................................7
2.10 Printer, Internal ...........................................................................7
2.11 Test Chamber .............................................................................7
2.12 Environmental Conditions ................................................................8
2.13 Monitor Headset..........................................................................8
2.14 Guarantee ................................................................................8
Chapter 3: Specification Test Procedure..........................................9
3.1 Source Frequency Accuracy................................................................9
3.2 Digital Measurement and Readout of SPL Accuracy ........................................9
3.3 Source Attenuator Accuracy................................................................9
3.4 Source Output Amplitude Accuracy.......................................................10
3.5 Telecoil Drive Current Accuracy ...........................................................10
3.6 Battery Simulator Voltage Accuracy .......................................................11
Chapter 4: Circuit Description.................................................. 13
4.1 General Description ......................................................................13
4.1.1 The following boards are used in the 8000 Main Module:...........................13
4.1.2 The following boards are used in the 8050 and 8120 Sound Chambers:.............13
4.1.3 The Probe Remote Module has:.....................................................13
4.1.4 The Single Board Computer(SBC) has: ..............................................13
4.1.5 The Parallel Interface Board has: ...................................................13