Fujitsu PRIMERGY TX100 S2 User Manual

TX100 S2 Operating Manual 35
Important notes
All batteries containing pollutants are marked with a symbol (a crossed-out
garbage can). They are also marked with the chemical symbol for the heavy
metal that causes them to be categorized as containing pollutants:
Cd Cadmium
Hg Mercury
Pb Lead
Labels on plastic casing parts
Please avoid sticking your own labels on plastic parts wherever possible, since
this makes it difficult to recycle them.
Returns, recycling and disposal
Please handle returns, recycling and disposal in accordance with local
regulations.
Details regarding the return and recycling of devices and consumables within
Europe can also be found in the "Returning used devices" manual, via your local
Fujitsu branch or from our recycling center in Paderborn:
Fujitsu Technology Solutions
Recycling Center
D-33106 Paderborn
Tel. +49 5251 8 18010
Fax +49 5251 8 333 18010
The device must not be disposed of with domestic waste. This
device is labeled in compliance with European directive
2002/96/EC on waste electrical and electronic equipment (WEEE).
This directive sets the framework for returning and recycling used
equipment and is valid across the EU. When returning your used
device, please use the return and collection systems available to
you. Further information can be found at
http://ts.fujitsu.com/recycling.

Fujitsu PRIMERGY TX100 S2 Specifications

General

Tcase	72.7 °C
Bus type	DMI
Stepping	B1
FSB Parity	No
Processor code	SLBLJ
Processor cache	8 MB
Processor cores	4
Processor model	X3430
System bus rate	2.5 GT/s
Processor series	Intel Xeon 3400 Series
Processor socket	LGA 1156 (Socket H)
Processor codename	Lynnfield
Motherboard chipset	Intel® 3420
Processing Die size	296 mm²
Processor frequency	2.4 GHz
Processor cache type	Smart Cache
Processor lithography	45 nm
Processor manufacturer	Intel
Processor package size	37.5 x 37.5 mm
Processor front side bus	- MHz
Processor boost frequency	2.8 GHz
Processor operating modes	64-bit
ECC supported by processor	Yes
PCI Express configurations	1x16, 2x8, 4x4
Supported instruction sets	SSE4.2
Thermal Design Power (TDP)	95 W
Number of processors installed	1
CPU multiplier (bus/core ratio)	18
Physical Address Extension (PAE)	36 bit
Maximum number of PCI Express lanes	16
Memory types supported by processor	DDR3-SDRAM
Number of Processing Die Transistors	774 M
Memory channels supported by processor	Dual
Memory clock speeds supported by processor	800, 1066, 1333 MHz
Memory bandwidth supported by processor (max)	21 GB/s
Maximum internal memory supported by processor	32 GB
HDD size	3.5 \
HDD interface	Serial ATA
Optical drive type	DVD-RW
Total storage capacity	1000 GB
Maximum storage capacity	4 TB
Number of HDDs installed	2
Memory slots	4x DIMM
Internal memory	4 GB
Memory clock speed	1333 MHz
Maximum internal memory	16 GB
Memory layout (slots x size)	2 x 2 GB
Maximum graphics card memory	64 MB
Graphics card	ES1000
LAN controller	Intel® 82578DM
Networking features	Gigabyte Ethernet
PS/2 ports quantity	0
USB 2.0 ports quantity	11
PCI Express slots version	2.0
Power supply	250 W
Power requirements	100 - 127 V, 200 - 240 V, 47 - 63 Hz
Power consumption (typical)	171 W
Noise level	24 dB
Operating system installed	-
Compatible operating systems	Windows Server 2008, Server 2003 Novell SUSE Linux Enterprise Server Red Hat Enterprise Linux
Operating temperature (T-T)	10 - 35 °C
Operating relative humidity (H-H)	10 - 85 %
Sustainability certificates	ENERGY STAR
Certification	GS CE CSAc/us ULc/us FCC CB RoHS WEEE
Chassis type	Tower
Processor ARK ID	42927
Intel® Turbo Boost Technology	1.0

Weight and Dimensions

Depth	386 mm
Width	203 mm
Height	390 mm
Weight	12000 g