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Bus type | QPI |
---|---|
Stepping | D1 |
Tjunction | 100 °C |
Processor cache | 3 MB |
Processor cores | 2 |
Processor model | i3-6100U |
System bus rate | 4 GT/s |
Processor family | Intel® Core™ i3 |
Processor series | Intel Core i3-6100 series |
Processor socket | BGA 1356 |
Processor threads | 4 |
Processor codename | Skylake |
Processor frequency | 2.3 GHz |
Processor cache type | Smart Cache |
Configurable TDP-down | 7.5 W |
Processor lithography | 14 nm |
Processor manufacturer | Intel |
Processor front side bus | - MHz |
PCI Express slots version | 3.0 |
Processor operating modes | 64-bit |
ECC supported by processor | No |
PCI Express configurations | 1x4, 4x1 |
Thermal Design Power (TDP) | 15 W |
Number of processors installed | 1 |
Configurable TDP-down frequency | 0.8 GHz |
Maximum number of PCI Express lanes | 12 |
Memory types supported by processor | DDR3L-SDRAM, LPDDR3-SDRAM, DDR4-SDRAM |
Memory clock speeds supported by processor | 1866, 2133, 1600 MHz |
Memory bandwidth supported by processor (max) | 34.1 GB/s |
Maximum internal memory supported by processor | 32 GB |
Memory slots | 2x DIMM |
Internal memory | 4 GB |
Memory channels | Dual-channel |
Memory clock speed | 2133 MHz |
Internal memory type | DDR4-SDRAM |
Memory layout (slots x size) | 1 x 4 GB |
Ethernet LAN | Yes |
Ethernet LAN data rates | 10, 100, 1000 Mbit/s |
USB 2.0 ports quantity | 6 |
USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity | 0 |
HDD speed | 7200 RPM |
HDD interface | SATA |
Storage media | HDD |
Optical drive type | DVD Super Multi |
Total storage capacity | 500 GB |
Chassis type | Micro Tower |
Product color | Black |
Country of origin | China |
Audio chip | Realtek ALC221 |
Product type | PC |
Motherboard chipset | Intel® H110 |
On-board graphics card ID | 1916 |
Discrete graphics card model | Not available |
On-board graphics card model | Intel® HD Graphics 520 |
On-board graphics card family | Intel® HD Graphics |
Maximum on-board graphics card memory | 1.74 GB |
On-board graphics card OpenGL version | 4.4 |
On-board graphics card base frequency | 300 MHz |
On-board graphics card DirectX version | 12.0 |
On-board graphics card dynamic frequency (max) | 1000 MHz |
Number of displays supported (on-board graphics) | 3 |
Sustainability certificates | EPEAT Silver, ENERGY STAR |
Power supply | 180 W |
Operating system installed | FreeDOS |
Processor code | SR2EU |
Processor ARK ID | 88180 |
Processor package size | 42 X 24 mm |
Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0 |
Intel Secure Key Technology version | 1.00 |
Intel Stable Image Platform Program (SIPP) version | 0.00 |
Depth | 355 mm |
---|---|
Width | 170 mm |
Height | 358.8 mm |
Weight | 6110 g |
Overview of the standard features and configuration options available for the computer models.
Identification and description of components located on the front of the computer chassis.
Identification and description of components located on the rear of the computer chassis.
Information on where to find the unique serial and product ID numbers for the computer.
Catalog of replaceable parts for the Microtower (MT) computer chassis.
Listing and illustration of the main internal components of the computer system.
Catalog of various smaller or accessory parts for the computer.
Catalog of various circuit boards and expansion cards for the computer.
List of available hard drives, solid-state drives, and optical drives for the computer.
Guidelines to prevent damage to electronic components from static electricity discharge.
Instructions for proper operation, airflow, cleaning, and environmental considerations for the computer.
Guidance on handling screws, cables, hard drives, and batteries to prevent damage.
Details on SATA hard drives, cables, SMART ATA drives, and proper cable management.
Steps required to prepare the computer before starting component removal or replacement.
Procedure for removing the computer's access panel to gain internal access.
Procedure for removing the front bezel from the computer chassis.
Instructions on how to secure the front bezel in place using a screw.
Procedure for removing the bezel blank covering the slim optical drive bay.
Detailed steps for installing DIMM memory modules into the system board sockets.
Procedure for adding, removing, or replacing expansion cards in the computer.
Detailed steps for removing and installing optical drives and hard drives.
Procedure for removing and replacing the front panel I/O and power switch assembly.
Procedure for removing the internal computer speaker.
Procedure for removing and replacing the fan located at the rear of the computer chassis.
Detailed steps for removing and replacing the computer's power supply unit.
Procedure for removing and reinstalling the processor fan sink (heat sink).
Instructions for removing and installing Intel and AMD processors.
Detailed steps for removing and installing the computer's system board.
Detailed guide to accessing and configuring system settings via the F10 utility.
Procedure for restoring computer setup configurations from saved media.
Ensuring a safe and comfortable work environment to prevent injury or discomfort.
Steps to take before calling support and helpful tips for resolving issues.
Resolving common computer issues like lockups, response problems, and incorrect system settings.
Guidance for diagnosing and fixing problems with display, audio, printer, keyboard, mouse, and network.
List of POST error codes, messages, and recommended actions for troubleshooting.
Understanding system validation codes indicated by front panel LEDs and beep patterns.
Procedures for changing, deleting, or resetting system and power-on passwords.
How to reset CMOS settings to factory defaults using the jumper or CMOS button.
Steps to start and perform hardware diagnostic tests using the UEFI tool.
Instructions for downloading the HP PC Hardware Diagnostics UEFI tool onto a USB drive.
Methods for creating recovery media and backups for system restoration.
Steps to recover the system using HP Recovery Manager, media, or Windows tools.
Specifications and requirements for power cords applicable globally and in specific countries.