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HP ENVY m6 User Manual

HP ENVY m6
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Cables and connectors
CAUTION: When servicing the computer, be sure that cables are placed in their proper locations during the
reassembly process. Improper cable placement can damage the computer.
Cables must be handled with extreme care to avoid damage. Apply only the tension required to unseat or
seat the cables during removal and insertion. Handle cables by the connector whenever possible. In all cases,
avoid bending, twisting, or tearing cables. Be sure that cables are routed in such a way that they cannot be
caught or snagged by parts being removed or replaced. Handle flex cables with extreme care; these cables
tear easily.
Drive handling
CAUTION: Drives are fragile components that must be handled with care. To prevent damage to the
computer, damage to a drive, or loss of information, observe these precautions:
Before removing or inserting a hard drive, shut down the computer. If you are unsure whether the computer
is off or in Hibernation, turn the computer on, and then shut it down through the operating system.
Before handling a drive, be sure that you are discharged of static electricity. While handling a drive, avoid
touching the connector.
Before removing a diskette drive or optical drive, be sure that a diskette or disc is not in the drive and be sure
that the optical drive tray is closed.
Handle drives on surfaces covered with at least one inch of shock-proof foam.
Avoid dropping drives from any height onto any surface.
After removing a hard drive, an optical drive, or a diskette drive, place it in a static-proof bag.
Avoid exposing an internal hard drive to products that have magnetic fields, such as monitors or speakers.
Avoid exposing a drive to temperature extremes or liquids.
If a drive must be mailed, place the drive in a bubble pack mailer or other suitable form of protective
packaging and label the package “FRAGILE.”
Grounding guidelines
Electrostatic discharge damage
Electronic components are sensitive to electrostatic discharge (ESD). Circuitry design and structure
determine the degree of sensitivity. Networks built into many integrated circuits provide some protection,
but in many cases, ESD contains enough power to alter device parameters or melt silicon junctions.
A discharge of static electricity from a finger or other conductor can destroy static-sensitive devices or
microcircuitry. Even if the spark is neither felt nor heard, damage may have occurred.
An electronic device exposed to ESD may not be affected at all and can work perfectly throughout a normal
cycle. Or the device may function normally for a while, then degrade in the internal layers, reducing its life
expectancy.
Grounding guidelines 29

Table of Contents

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HP ENVY m6 Specifications

General IconGeneral
LED backlightYes
Display surfaceGloss
Display diagonal15.6 \
Display brightness200 cd/m²
Display resolution1366 x 768 pixels
Native aspect ratio16:9
Bus typeDMI
Tjunction105 °C
Processor cache6 MB
Processor cores4
System bus rate5 GT/s
Processor familyIntel® Core™ i7
Processor seriesIntel Core i7-3600 Mobile series
Processor socketSocket 1224
Processor threads8
Processor codenameIvy Bridge
Processor frequency2.2 GHz
Processor cache typeSmart Cache
Processor lithography22 nm
Processor manufacturerIntel
Processor front side bus- MHz
PCI Express slots version3.0
Processor boost frequency3.2 GHz
Processor operating modes64-bit
PCI Express configurations1x16, 2x8, 1x8+2x4
Thermal Design Power (TDP)35 W
CPU multiplier (bus/core ratio)22
Maximum number of PCI Express lanes16
Motherboard chipset-
Memory slots2x SO-DIMM
Internal memory4 GB
Memory clock speed1600 MHz
Internal memory typeDDR3-SDRAM
Maximum internal memory- GB
HDD speed5400 RPM
HDD interfaceSATA
Storage mediaHDD
Optical drive typeDVD Super Multi
Total storage capacity1000 GB
Compatible memory cardsMMC, SD
Number of HDDs installed1
Number of SSDs installed0
On-board graphics card ID0x166
Discrete graphics card modelAMD Radeon HD 7670M
On-board graphics card modelIntel® HD Graphics 4000
Discrete graphics card memory2 GB
Discrete graphics memory typeGDDR3
On-board graphics card familyIntel® HD Graphics
On-board graphics card base frequency650 MHz
On-board graphics card dynamic frequency (max)1150 MHz
Audio systemBeats Audio
Number of built-in speakers2
Video capturing speed30 fps
Data networkNot supported
Wi-Fi standards802.11b, 802.11g, Wi-Fi 4 (802.11n)
Bluetooth version4.0
Cabling technology10/100/1000Base-T(X)
Networking featuresGigabit LAN, WLAN
Ethernet LAN data rates10, 100, 1000 Mbit/s
Charging port typeDC-in jack
Headphone connectivity3.5 mm
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity3
Pointing deviceTouchpad
Operating system installedWindows 8
Form factorClamshell
Product typeLaptop
Product colorSilver
Country of originChina
Processor ARK ID71458
Processor package size37.5 x 37.5 (rPGA988B) mm
Supported instruction setsAVX
Intel Identity Protection Technology version1.00
Battery life (max)- h
Number of battery cells6
AC adapter power90 W
AC adapter frequency50 - 60 Hz
AC adapter input voltage100 - 240 V
Operating altitude-15 - 3048 m
Non-operating altitude-15 - 12192 m
Storage temperature (T-T)-20 - 60 °C
Operating temperature (T-T)5 - 35 °C
Storage relative humidity (H-H)5 - 95 %
Operating relative humidity (H-H)10 - 90 %
Weight and Dimensions IconWeight and Dimensions
Depth250.7 mm
Width379.5 mm
Height26.5 mm
Weight2400 g

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