HP ProBook 430 G2 Maintenance And Service Guide

Grounding guidelines
Electrostatic discharge damage
Electronic components are sensitive to electrostatic discharge (ESD). Circuitry design and structure determine
the degree of sensitivity. Networks built into many integrated circuits provide some protection, but in many
cases, ESD contains enough power to alter device parameters or melt silicon junctions.
A discharge of static electricity from a nger or other conductor can destroy static-sensitive devices or
microcircuitry. Even if the spark is neither felt nor heard, damage may have occurred.
An electronic device exposed to ESD may not be aected at all and can work perfectly throughout a normal
cycle. Or the device may function normally for a while, and then degrade in the internal layers, reducing its life
expectancy.
CAUTION: To prevent damage to the computer when you are removing or installing internal components,
observe these precautions:
Keep components in their electrostatic-safe containers until you are ready to install them.
Use nonmagnetic tools.
Before touching an electronic component, discharge static electricity by using the guidelines described in this
section.
Avoid touching pins, leads, and circuitry. Handle electronic components as little as possible.
If you remove a component, place it in an electrostatic-safe container.
The following table shows how humidity aects the electrostatic voltage levels generated by dierent
activities.
CAUTION: A product can be degraded by as little as 700 V.
Typical electrostatic voltage levels
Relative humidity
Event 10% 40% 55%
Walking across carpet 35,000 V 15,000 V 7,500 V
Walking across vinyl oor 12,000 V 5,000 V 3,000 V
Motions of bench worker 6,000 V 800 V 400 V
Removing DIPS from plastic tube 2,000 V 700 V 400 V
Removing DIPS from vinyl tray 11,500 V 4,000 V 2,000 V
Removing DIPS from Styrofoam 14,500 V 5,000 V 3,500 V
Removing bubble pack from PCB 26,500 V 20,000 V 7,000 V
Packing PCBs in foam-lined box 21,000 V 11,000 V 5,000 V
26 Chapter 4 Removal and replacement procedures preliminary requirements

HP ProBook 430 G2 Specifications

General

Form factor	Clamshell
Product type	Laptop
Product color	Black, Grey
Country of origin	China
Bus type	DMI2
Stepping	D0
Tjunction	100 °C
Processor cache	3 MB
Processor cores	2
Processor model	i5-4210U
System bus rate	5 GT/s
Processor family	Intel® Core™ i5
Processor series	Intel Core i5-4200 Mobile series
Processor socket	BGA 1168
Processor threads	4
Processor codename	Haswell
Processor frequency	1.7 GHz
Processor cache type	Smart Cache
Processor lithography	22 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	2.0
Processor boost frequency	2.7 GHz
Processor operating modes	64-bit
ECC supported by processor	No
PCI Express configurations	4x1, 2x4
Thermal Design Power (TDP)	15 W
Maximum number of PCI Express lanes	12
Motherboard chipset	-
Memory slots	2x SO-DIMM
Internal memory	4 GB
Memory clock speed	1600 MHz
Memory form factor	SO-DIMM
Internal memory type	DDR3-SDRAM
Maximum internal memory	- GB
Memory layout (slots x size)	1 x 4 GB
SSD capacity	The Solid State Drive's storage capacity in Gigabytes.
SSD interface	SATA
Storage media	SSD
Card reader integrated	Yes
Total storage capacity	128 GB
Number of SSDs installed	1
Display diagonal	13.3 \
Display resolution	1366 x 768 pixels
Native aspect ratio	16:9
On-board graphics card ID	0xA16
Discrete graphics card model	Not available
On-board graphics card model	Intel® HD Graphics 4400
On-board graphics card family	Intel® HD Graphics
Maximum on-board graphics card memory	1.74 GB
On-board graphics card base frequency	200 MHz
On-board graphics card dynamic frequency (max)	1000 MHz
Intel segment tagging	Enterprise, Professional
Audio system	DTS Sound+
Wi-Fi standards	802.11a, Wi-Fi 5 (802.11ac), 802.11b, 802.11g, Wi-Fi 4 (802.11n)
Bluetooth version	4.0
Ethernet LAN data rates	10, 100, 1000 Mbit/s
Charging port type	DC-in jack
DisplayPorts quantity	0
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Pointing device	Touchpad
Recovery operating system	Windows 8.1 Pro
Operating system installed	Windows 7 Professional
Processor code	SR1EF
Processor ARK ID	81016
Intel TSX-NI version	0.00
Processor package size	40 x 24 x 1.5 mm
Intel ME Firmware Version	9.5
Supported instruction sets	AVX 2.0, SSE4.1, SSE4.2
Intel Smart Connect Technology version	1.00
Battery capacity	44 Wh
Battery life (max)	- h

Weight and Dimensions

Depth	233.5 mm
Width	326 mm
Weight	1500 g
Height (rear)	21 mm
Height (front)	20 mm