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HP Stream 11 Pro User Manual

HP Stream 11 Pro
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Packaging and transporting guidelines
Follow these grounding guidelines when packaging and transporting equipment:
To avoid hand contact, transport products in static-safe tubes, bags, or boxes.
Protect ESD-sensitive parts and assemblies with conductive or approved containers or packaging.
Keep ESD-sensitive parts in their containers until the parts arrive at static-free workstations.
Place items on a grounded surface before removing items from their containers.
Always be properly grounded when touching a component or assembly.
Store reusable ESD-sensitive parts from assemblies in protective packaging or nonconductive foam.
Use transporters and conveyors made of antistatic belts and roller bushings. Be sure that mechanized
equipment used for moving materials is wired to ground and that proper materials are selected to avoid
static charging. When grounding is not possible, use an ionizer to dissipate electric charges.
Workstation guidelines
Follow these grounding workstation guidelines:
Cover the workstation with approved static-shielding material.
Use a wrist strap connected to a properly grounded work surface and use properly grounded tools and
equipment.
Use conductive field service tools, such as cutters, screw drivers, and vacuums.
When fixtures must directly contact dissipative surfaces, use fixtures made only of static-
safe materials.
Keep the work area free of nonconductive materials, such as ordinary plastic assembly aids
and Styrofoam.
Handle ESD-sensitive components, parts, and assemblies by the case or PCM laminate. Handle these
items only at static-free workstations.
Avoid contact with pins, leads, or circuitry.
Turn off power and input signals before inserting or removing connectors or test equipment.
20 Chapter 4 Removal and replacement preliminary requirements

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HP Stream 11 Pro Specifications

General IconGeneral
Form factorClamshell
Product typeLaptop
Product colorBlack, Grey
Country of originChina
SteppingC0
Tjunction100 °C
Processor cache1 MB
Processor cores2
System bus rate- GT/s
Processor familyIntel® Celeron®
Processor seriesIntel Celeron Processor N2000 Series for Mobile
Processor socketBGA 1170
Processor codenameBay Trail
Processor frequency2.16 GHz
Processor cache typeL2
Processor lithography22 nm
Processor manufacturerIntel
Processor front side bus- MHz
PCI Express slots version2.0
Processor boost frequency2.58 GHz
Processor operating modes32-bit, 64-bit
ECC supported by processorNo
PCI Express configurations1x4
Thermal Design Power (TDP)7.5 W
Scenario Design Power (SDP)4.5 W
Maximum number of PCI Express lanes4
Motherboard chipset-
Internal memory2 GB
Memory clock speed1333 MHz
Memory form factorOn-board
Internal memory typeDDR3L-SDRAM
SSD capacityThe Solid State Drive's storage capacity in Gigabytes.
Storage mediaSSD
Card reader integratedYes
Total storage capacity32 GB
Compatible memory cardsSD, SDHC, SDXC
Number of SSDs installed1
Display surfaceMatt
Display diagonal11.6 \
Display resolution1366 x 768 pixels
Native aspect ratio16:9
Discrete graphics card modelNot available
On-board graphics card modelIntel® HD Graphics
On-board graphics card base frequency311 MHz
On-board graphics card burst frequency792 MHz
Audio systemDTS Studio Sound
Wi-Fi standards802.11b, 802.11g, Wi-Fi 4 (802.11n)
Bluetooth version4.0
Top Wi-Fi standardWi-Fi 4 (802.11n)
Charging port typeDC-in jack
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
VGA (D-Sub) ports quantity0
Pointing deviceTouchpad
Operating system installedWindows 8.1
Operating system architecture64-bit
Processor codeSR1YJ
Processor ARK ID82103
Processor package size25 x 27 mm
Intel Smart Connect Technology version1.00
Battery capacity37 Wh
Battery life (max)- h
Number of battery cells3
AC adapter power45 W
Sustainability certificatesEPEAT Silver, ENERGY STAR
Weight and Dimensions IconWeight and Dimensions
Depth205.7 mm
Width300 mm
Height19.7 mm
Weight1280 g

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