HP TOUCHSMART TM2 Maintenance And Service Guide

Reverse this procedure to install the power connector and cable.
Fan
Description Spare part number
Fan 592970-001
NOTE: To properly ventilate the computer, allow at least a 7.6-cm (3-inch) clearance on the right side
and rear panel of the computer.
The computer uses an electric fan for ventilation. The fan is controlled by a temperature sensor and is
designed to turn on automatically when high temperature conditions exist. These conditions are affected
by high external temperatures, system power consumption, power management/battery conservation
configurations, battery fast charging, and software requirements. Exhaust air is displaced through the
ventilation grill located on the left side of the computer.
Before removing the fan, follow these steps:
1. Shut down the computer. If you are unsure whether the computer is off or in Hibernation, turn the
computer on, and then shut it down through the operating system.
2. Disconnect all external devices connected to the computer.
3. Disconnect the power cord.
4. Remove the battery (see
Battery on page 35).
5. Remove the following components:
a. Hard drive (see
Hard drive on page 37)
b. Top cover (see
Top cover on page 48)
c.
Keyboard (see
Keyboard on page 50)
d. Display assembly (see
Display assembly on page 55)
e. System board (see
System board on page 59)
Remove the fan:
1. Turn the system board upside down, with the rear toward you.
2. Disconnect the fan cable (1) from the system board.
3. Remove the two Phillips PM2.5×6.0 screws (2) that secure the fan to the system board.
ENWW
Component replacement procedures
63

HP TOUCHSMART TM2 Specifications

General

Bus type	DMI
Stepping	K0
Tjunction	105 °C
Processor cache	3 MB
Processor cores	2
System bus rate	2.5 GT/s
Processor family	Intel® Core™ i3
Processor series	Intel Core i3-300 Mobile Series
Processor socket	BGA 1288
Processor threads	4
Processor codename	Arrandale
Processing Die size	81 mm²
Processor frequency	1.33 GHz
Processor cache type	Smart Cache
Processor lithography	32 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	2.0
Processor boost frequency	The turbo boost is an automatic, managed accelleration of the processor when one of the cores is overloaded.
Processor operating modes	64-bit
ECC supported by processor	No
PCI Express configurations	1x16
Thermal Design Power (TDP)	18 W
CPU multiplier (bus/core ratio)	10
Maximum number of PCI Express lanes	16
Number of Processing Die Transistors	382 M
Motherboard chipset	Intel® HM55 Express
Internal memory	3 GB
Internal memory type	DDR3-SDRAM
Maximum internal memory	8 GB
Memory layout (slots x size)	1 x 1 + 1 x 2 GB
HDD speed	7200 RPM
HDD interface	SATA
Storage media	HDD
Optical drive type	DVD Super Multi DL
Card reader integrated	Yes
Total storage capacity	320 GB
Compatible memory cards	Memory Stick (MS), MMC, MS PRO, SD, xD
Number of HDDs installed	1
Display diagonal	12.1 \
Touch technology	Multi-touch
Display resolution	1280 x 800 pixels
Native aspect ratio	16:10
Ethernet interface type	Gigabit Ethernet
Operating temperature (T-T)	41 - 95 °F
Discrete graphics card model	Not available
On-board graphics card model	Intel® HD Graphics
On-board graphics card base frequency	166 MHz
On-board graphics card dynamic frequency (max)	500 MHz
Audio system	Dolby Advanced
Speakers manufacturer	Altec Lansing
Wi-Fi standards	802.11b, 802.11g, Wi-Fi 4 (802.11n)
Cabling technology	10/100/1000Base-T(X)
Networking features	Gigabit LAN, WLAN
Ethernet LAN data rates	10, 100, 1000 Mbit/s
Charging port type	DC-in jack
USB 2.0 ports quantity	3
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	0
Keyboard layout	-
Pointing device	Clickpad
Operating system installed	Windows 7 Home Premium
Form factor	Convertible (Swivel)
Product type	Hybrid (2-in-1)
Country of origin	China
Battery life (max)	- h
Number of battery cells	6
AC adapter power	65 W
Cable lock slot type	Kensington
Operating altitude	-15 - 3048 m
Non-operating altitude	-15 - 12192 m
Storage temperature (T-T)	-20 - 60 °C
Storage relative humidity (H-H)	5 - 95 %
Operating relative humidity (H-H)	10 - 90 %
Processor code	SLBSL
Processor ARK ID	50028
Processor package size	BGA 34 x 28 mm
Graphics & IMC lithography	45 nm
Supported instruction sets	SSE4.1, SSE4.2

Weight and Dimensions

Depth	326 mm
Width	230 mm
Weight	1893 g
Height (rear)	30 mm
Height (front)	24.3 mm