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HP TOUCHSMART TM2 Maintenance And Service Guide

HP TOUCHSMART TM2
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Restore to a previous date and time
To revert to a restore point (created at a previous date and time), when the computer was functioning
optimally, follow these steps:
1.
Select Start > Control Panel > System and Security > System.
2.
In the left pane, click System protection.
3.
Click the System Protection tab.
4. Click System Restore.
5. Follow the on-screen instructions.
Performing a recovery
NOTE: You can recover only files that you have previously backed up. HP recommends that you use
HP Recovery Manager to create a set of recovery discs (entire drive backup) as soon as you set up your
computer.
Recovery Manager software allows you to repair or restore the system if you experience system failure
or instability. Recovery Manager works from recovery discs or from a dedicated recovery partition
(select models only) on the hard drive. However, if your computer includes a solid-state drive (SSD), you
may not have a recovery partition. If that is the case, recovery discs have been included with your
computer. Use these discs to recover your operating system and software.
NOTE: Windows has its own built-in repair features, such as System Restore. If you have not already
tried these features, try them before using Recovery Manager.
NOTE: Recovery Manager recovers only software that was preinstalled at the factory. Software not
provided with this computer must be downloaded from the manufacturer's Web site or reinstalled from
the disc provided by the manufacturer.
Recovering from the recovery discs
To restore the system from the recovery discs:
1.
Back up all personal files.
2. Insert the first recovery disc into an optional external optical drive and restart the computer.
3. Follow the on-screen instructions.
84 Chapter 7 Backup and recovery ENWW

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HP TOUCHSMART TM2 Specifications

General IconGeneral
Bus typeDMI
SteppingK0
Tjunction105 °C
Processor cache3 MB
Processor cores2
System bus rate2.5 GT/s
Processor familyIntel® Core™ i3
Processor seriesIntel Core i3-300 Mobile Series
Processor socketBGA 1288
Processor threads4
Processor codenameArrandale
Processing Die size81 mm²
Processor frequency1.33 GHz
Processor cache typeSmart Cache
Processor lithography32 nm
Processor manufacturerIntel
Processor front side bus- MHz
PCI Express slots version2.0
Processor boost frequencyThe turbo boost is an automatic, managed accelleration of the processor when one of the cores is overloaded.
Processor operating modes64-bit
ECC supported by processorNo
PCI Express configurations1x16
Thermal Design Power (TDP)18 W
CPU multiplier (bus/core ratio)10
Maximum number of PCI Express lanes16
Number of Processing Die Transistors382 M
Motherboard chipsetIntel® HM55 Express
Internal memory3 GB
Internal memory typeDDR3-SDRAM
Maximum internal memory8 GB
Memory layout (slots x size)1 x 1 + 1 x 2 GB
HDD speed7200 RPM
HDD interfaceSATA
Storage mediaHDD
Optical drive typeDVD Super Multi DL
Card reader integratedYes
Total storage capacity320 GB
Compatible memory cardsMemory Stick (MS), MMC, MS PRO, SD, xD
Number of HDDs installed1
Display diagonal12.1 \
Touch technologyMulti-touch
Display resolution1280 x 800 pixels
Native aspect ratio16:10
Ethernet interface typeGigabit Ethernet
Operating temperature (T-T)41 - 95 °F
Discrete graphics card modelNot available
On-board graphics card modelIntel® HD Graphics
On-board graphics card base frequency166 MHz
On-board graphics card dynamic frequency (max)500 MHz
Audio systemDolby Advanced
Speakers manufacturerAltec Lansing
Wi-Fi standards802.11b, 802.11g, Wi-Fi 4 (802.11n)
Cabling technology10/100/1000Base-T(X)
Networking featuresGigabit LAN, WLAN
Ethernet LAN data rates10, 100, 1000 Mbit/s
Charging port typeDC-in jack
USB 2.0 ports quantity3
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity0
Keyboard layout-
Pointing deviceClickpad
Operating system installedWindows 7 Home Premium
Form factorConvertible (Swivel)
Product typeHybrid (2-in-1)
Country of originChina
Battery life (max)- h
Number of battery cells6
AC adapter power65 W
Cable lock slot typeKensington
Operating altitude-15 - 3048 m
Non-operating altitude-15 - 12192 m
Storage temperature (T-T)-20 - 60 °C
Storage relative humidity (H-H)5 - 95 %
Operating relative humidity (H-H)10 - 90 %
Processor codeSLBSL
Processor ARK ID50028
Processor package sizeBGA 34 x 28 mm
Graphics & IMC lithography45 nm
Supported instruction setsSSE4.1, SSE4.2
Weight and Dimensions IconWeight and Dimensions
Depth326 mm
Width230 mm
Weight1893 g
Height (rear)30 mm
Height (front)24.3 mm

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