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HP TOUCHSMART TM2 Maintenance And Service Guide

HP TOUCHSMART TM2
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Creating recovery discs
HP recommends that you create recovery discs to be sure that you can restore your system to its original
factory state if you experience serious system failure or instability. Create these discs after setting up the
computer for the first time.
Handle these discs carefully and keep them in a safe place. The software allows the creation of only
one set of recovery discs.
NOTE: If your computer does not include an integrated optical drive, you can use an optional
external optical drive (purchased separately) to create recovery discs, or you can purchase recovery
discs for your computer from the HP Web site.
Note the following guidelines before creating recovery discs:
You will need high-quality DVD-R, DVD+R, BD-R (writable Blu-ray), or CD-R discs. All these discs
are purchased separately. DVDs and BDs have a much higher capacity than CDs. If you use CDs,
up to 20 discs may be required, whereas only a few DVDs or BDs are required.
NOTE: Read-write discs, such as CD-RW, DVD±RW, double-layer DVD±RW, and BD-RE
(rewritable Blu-ray) discs, are not compatible with the Recovery Manager software.
The computer must be connected to AC power during this process.
Only one set of recovery discs can be created per computer.
Number each disc before inserting it into the optical drive.
If necessary, you can exit the program before you have finished creating the recovery discs. The
next time you open Recovery Manager, you will be prompted to continue the disc creation
process.
To create a set of recovery discs:
1.
Select Start > All Programs > Recovery Manager > Recovery Disc Creation.
2.
Follow the on-screen instructions.
ENWW
Creating recovery discs
81

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HP TOUCHSMART TM2 Specifications

General IconGeneral
Bus typeDMI
SteppingK0
Tjunction105 °C
Processor cache3 MB
Processor cores2
System bus rate2.5 GT/s
Processor familyIntel® Core™ i3
Processor seriesIntel Core i3-300 Mobile Series
Processor socketBGA 1288
Processor threads4
Processor codenameArrandale
Processing Die size81 mm²
Processor frequency1.33 GHz
Processor cache typeSmart Cache
Processor lithography32 nm
Processor manufacturerIntel
Processor front side bus- MHz
PCI Express slots version2.0
Processor boost frequencyThe turbo boost is an automatic, managed accelleration of the processor when one of the cores is overloaded.
Processor operating modes64-bit
ECC supported by processorNo
PCI Express configurations1x16
Thermal Design Power (TDP)18 W
CPU multiplier (bus/core ratio)10
Maximum number of PCI Express lanes16
Number of Processing Die Transistors382 M
Motherboard chipsetIntel® HM55 Express
Internal memory3 GB
Internal memory typeDDR3-SDRAM
Maximum internal memory8 GB
Memory layout (slots x size)1 x 1 + 1 x 2 GB
HDD speed7200 RPM
HDD interfaceSATA
Storage mediaHDD
Optical drive typeDVD Super Multi DL
Card reader integratedYes
Total storage capacity320 GB
Compatible memory cardsMemory Stick (MS), MMC, MS PRO, SD, xD
Number of HDDs installed1
Display diagonal12.1 \
Touch technologyMulti-touch
Display resolution1280 x 800 pixels
Native aspect ratio16:10
Ethernet interface typeGigabit Ethernet
Operating temperature (T-T)41 - 95 °F
Discrete graphics card modelNot available
On-board graphics card modelIntel® HD Graphics
On-board graphics card base frequency166 MHz
On-board graphics card dynamic frequency (max)500 MHz
Audio systemDolby Advanced
Speakers manufacturerAltec Lansing
Wi-Fi standards802.11b, 802.11g, Wi-Fi 4 (802.11n)
Cabling technology10/100/1000Base-T(X)
Networking featuresGigabit LAN, WLAN
Ethernet LAN data rates10, 100, 1000 Mbit/s
Charging port typeDC-in jack
USB 2.0 ports quantity3
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity0
Keyboard layout-
Pointing deviceClickpad
Operating system installedWindows 7 Home Premium
Form factorConvertible (Swivel)
Product typeHybrid (2-in-1)
Country of originChina
Battery life (max)- h
Number of battery cells6
AC adapter power65 W
Cable lock slot typeKensington
Operating altitude-15 - 3048 m
Non-operating altitude-15 - 12192 m
Storage temperature (T-T)-20 - 60 °C
Storage relative humidity (H-H)5 - 95 %
Operating relative humidity (H-H)10 - 90 %
Processor codeSLBSL
Processor ARK ID50028
Processor package sizeBGA 34 x 28 mm
Graphics & IMC lithography45 nm
Supported instruction setsSSE4.1, SSE4.2
Weight and Dimensions IconWeight and Dimensions
Depth326 mm
Width230 mm
Weight1893 g
Height (rear)30 mm
Height (front)24.3 mm

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