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HP TOUCHSMART TM2 Maintenance And Service Guide

HP TOUCHSMART TM2
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7 Backup and recovery
Recovery after a system failure is as complete as your most current backup. HP recommends that you
create recovery discs immediately after software setup. As you add new software and data files, you
should continue to back up your system on a regular basis to maintain a reasonably current backup.
Tools provided by the operating system and HP Recovery Manager software are designed to help you
with the following tasks for safeguarding your information and restoring it in case of a system failure:
Creating a set of recovery discs (Recovery Manager software feature). Recovery discs are used to
start up (boot) your computer and restore the operating system and software programs to factory
settings in case of system failure or instability.
Backing up your information regularly to protect your important system files.
Creating system restore points (operating system feature). System restore points allow you to
reverse undesirable changes to your computer by restoring the computer to an earlier state.
Recovering a program or driver (Recovery Manager software feature). This feature helps you
reinstall a program or driver without performing a full system recovery.
Performing a full system recovery (Recovery Manager software feature). With Recovery Manager,
you can recover your full factory image if you experience system failure or instability. Recovery
Manager works from a dedicated recovery partition (select models only) on the hard drive or from
recovery discs you create.
NOTE: Computers with a solid-state drive (SSD) may not have a recovery partition. Recovery
discs have been included for computers that do not have a partition. Use these discs to recover
your operating system and software. To check for the presence of a recovery partition, click Start,
right-click Computer, click Manage, and then click Disk Management. If the partition is
present, an HP Recovery drive is listed in the window.
80 Chapter 7 Backup and recovery ENWW

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HP TOUCHSMART TM2 Specifications

General IconGeneral
Bus typeDMI
SteppingK0
Tjunction105 °C
Processor cache3 MB
Processor cores2
System bus rate2.5 GT/s
Processor familyIntel® Core™ i3
Processor seriesIntel Core i3-300 Mobile Series
Processor socketBGA 1288
Processor threads4
Processor codenameArrandale
Processing Die size81 mm²
Processor frequency1.33 GHz
Processor cache typeSmart Cache
Processor lithography32 nm
Processor manufacturerIntel
Processor front side bus- MHz
PCI Express slots version2.0
Processor boost frequencyThe turbo boost is an automatic, managed accelleration of the processor when one of the cores is overloaded.
Processor operating modes64-bit
ECC supported by processorNo
PCI Express configurations1x16
Thermal Design Power (TDP)18 W
CPU multiplier (bus/core ratio)10
Maximum number of PCI Express lanes16
Number of Processing Die Transistors382 M
Motherboard chipsetIntel® HM55 Express
Internal memory3 GB
Internal memory typeDDR3-SDRAM
Maximum internal memory8 GB
Memory layout (slots x size)1 x 1 + 1 x 2 GB
HDD speed7200 RPM
HDD interfaceSATA
Storage mediaHDD
Optical drive typeDVD Super Multi DL
Card reader integratedYes
Total storage capacity320 GB
Compatible memory cardsMemory Stick (MS), MMC, MS PRO, SD, xD
Number of HDDs installed1
Display diagonal12.1 \
Touch technologyMulti-touch
Display resolution1280 x 800 pixels
Native aspect ratio16:10
Ethernet interface typeGigabit Ethernet
Operating temperature (T-T)41 - 95 °F
Discrete graphics card modelNot available
On-board graphics card modelIntel® HD Graphics
On-board graphics card base frequency166 MHz
On-board graphics card dynamic frequency (max)500 MHz
Audio systemDolby Advanced
Speakers manufacturerAltec Lansing
Wi-Fi standards802.11b, 802.11g, Wi-Fi 4 (802.11n)
Cabling technology10/100/1000Base-T(X)
Networking featuresGigabit LAN, WLAN
Ethernet LAN data rates10, 100, 1000 Mbit/s
Charging port typeDC-in jack
USB 2.0 ports quantity3
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity0
Keyboard layout-
Pointing deviceClickpad
Operating system installedWindows 7 Home Premium
Form factorConvertible (Swivel)
Product typeHybrid (2-in-1)
Country of originChina
Battery life (max)- h
Number of battery cells6
AC adapter power65 W
Cable lock slot typeKensington
Operating altitude-15 - 3048 m
Non-operating altitude-15 - 12192 m
Storage temperature (T-T)-20 - 60 °C
Storage relative humidity (H-H)5 - 95 %
Operating relative humidity (H-H)10 - 90 %
Processor codeSLBSL
Processor ARK ID50028
Processor package sizeBGA 34 x 28 mm
Graphics & IMC lithography45 nm
Supported instruction setsSSE4.1, SSE4.2
Weight and Dimensions IconWeight and Dimensions
Depth326 mm
Width230 mm
Weight1893 g
Height (rear)30 mm
Height (front)24.3 mm

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