Theory of Operation
20 Developer’s Kit User Manual
limit is the range within which the electrical circuits can be expected to meet their
specified performance requirements. Operation outside the functional limit can
degrade system performance and cause reliability problems potentially including
failure of the part and damage to the system.
The development kit is shipped with a heatsink thermal solution installed on the
processor and chipset. This thermal solution has been tested and is sufficient for
development purposes. The designer must ensure that adequate thermal management
is provided for if the system is used in other environments or enclosures.
3.3.1 Thermal Solution
The Thermal Design Power (TDP) for the processor and chipset is less than 10W. The
system can be passively cooled with a maximum 40 W dissipation.
3.4 Power Management
3.4.1 Power Management States
1Table 6 lists the power management states defined for the platform.
Table 6. Platform Power Management States
State Description
G0/S0/C0 Full on
G0/S0/C1 Auto Halt
G0/S0/C2 STPCLK# signal active
G0/S0/C3 Deep Sleep: Clock to CPU stopped
G0/S0/C4 Deeper Sleep: DPRSLP# signal active
G1/S3 Suspend To RAM (all switched rails are turned off)
G1/S4 Suspend To Disk
G2/S5 Soft Off
G3 Mechanical Off
3.4.2 Power Measurement Support
Power measurement resistors are provided on the platform to measure the power of
most subsystems. All power measurement resistors have a tolerance of 1%. The value
of these power measurement resistors are 2-mOhm by default. Power on a particular
subsystem is calculated using the following formula:
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