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1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 2 summarizes the major features of the board.
Table 2. Feature Summary
Form Factor
Mini-ITX (6.7 inches by 6.7 inches [170.18 millimeters by 170.18 millimeters])
Processor
•
3
rd
generation Intel
®
Core processor family and 2
nd
generation Intel
®
Core
processor family processors with up to 65 W TDP in an LGA1155 socket
― Integrated memory controller with dual channel DDR3 memory support
― Integrated graphics processing (processors with Intel
®
HD Graphics)
― External graphics interface controller
Memory
• Two 204-pin DDR3 SDRAM Small Outline Dual Inline Memory Module (SO-
DIMM) sockets
• Support for DDR3 1600 MHz, DDR3 1333 MHz, and DDR3 1066 MHz SO-
DIMMs
• Support for 1 Gb, 2 Gb, and 4 Gb memory technology
• Support for up to 16 GB of system memory with two SO-DIMMs using 4 Gb
memory technology
• Support for non-ECC memory
• Support for 1.5 V (standard voltage) and 1.35 V (low voltage) JEDEC memory
• Support for XMP memory
Note: DDR3 1600 MHz SO-DIMMs are only supported by 3
rd
generation Intel
Core processor family processors
Chipset
Intel
Q77 Express Chipset consisting of the Intel
Q77 Express Platform
Controller Hub (PCH)
Graphics
• Integrated graphics support for processors with Intel
Graphics Technology:
― High Definition Multimedia Interface* (HDMI*)
― DisplayPort*
― Internal flat panel displays:
LVDS
eDP (Embedded DisplayPort)
Audio
•
6-channel (4+2) Intel High Definition Audio via the Realtek* ALC892 audio
codec
• 8-channel (7.1) Intel HD Audio via the DisplayPort connector from the PCH
continued
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