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1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the board.
Table 1. Feature Summary
Form Factor
ATX (12.00 inches by 9.60 inches [304.80 millimeters by 243.84 millimeters])
Processor
• Intel
®
Core™ i7 and Intel
®
Xeon
®
Processors in an LGA1366 socket
Memory
• Six 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for DDR3 2400 MHz, 2133 MHz, 1866 MHz, 1600 MHz, 1333 MHz, and
1066 MHz DIMMs.
― Speeds over 1600 Mhz via XMP profiles
• Support for up to 24 GB of system memory with 6 DIMMs using 4 Gb memory
technology
• Support for ECC and non-ECC memory
• XMP version 1.2
Chipset
Intel
®
X58 Chipset, consisting of:
• Intel
®
X58 I/O Hub (IOH)
• Intel
®
82801IJR I/O Controller Hub (ICH10R)
Audio Intel
®
High Definition Audio subsystem using the Realtek* ALC892 audio codec.
Legacy I/O Control Winbond W83677HG-I legacy I/O controller for Consumer Infrared (CIR)
Peripheral
Interfaces
• Two USB 3.0 ports are implemented with stacked back panel connectors (blue)
• Twelve USB 2.0 ports:
― Six ports are implemented with stacked back panel connectors (black)
― Six front panel ports implemented through four internal headers
• Two external SATA (eSATA) 3 Gb/s interfaces through a Marvel 88SE6121
discrete eSATA controller (red)
• Eight internal SATA interfaces with RAID support:
― Two SATA 6 Gb/s interfaces through Marvel 88SE9128 controller (blue)
― Six SATA 3 Gb/s interfaces through the ICH10R (black)
• Two IEEE 1394a ports:
― One port via a back panel connector
― One port via an internal header for front panel cabling
BIOS
• Intel
®
BIOS resident in the Serial Peripheral Interface (SPI) Flash device
• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
and System Management BIOS (SMBIOS)
Instantly Available
PC Technology
• Support for PCI Local Bus Specification Revision 2.2
• Support for PCI Express* Revision 2.0
• Suspend to RAM support
• Wake on PCI, front panel, CIR, and USB ports
continued
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