Intel E2180 - Pentium Dual-Core 2.00GHz 800MHz 1MB Socket 775 CPU User Manual

Thermal and Mechanical Design Guidelines 7
Figure 7-21. Detailed Thermocouple Bead Placement ...........................................98
Figure 7-22. Third Tape Installation...................................................................98
Figure 7-23. Measuring Resistance Between Thermocouple and IHS .......................99
Figure 7-24. Applying Flux to the Thermocouple Bead ........................................100
Figure 7-25. Cutting Solder ............................................................................100
Figure 7-26. Positioning Solder on IHS.............................................................101
Figure 7-27. Solder Station Setup ...................................................................102
Figure 7-28. View Through Lens at Solder Station..............................................103
Figure 7-29. Moving Solder back onto Thermocouple Bead.................................. 103
Figure 7-30. Removing Excess Solder ..............................................................104
Figure 7-31. Thermocouple placed into groove ..................................................105
Figure 7-32. Removing Excess Solder ..............................................................105
Figure 7-33. Filling Groove with Adhesive.........................................................106
Figure 7-34. Application of Accelerant..............................................................106
Figure 7-35. Removing Excess Adhesive from IHS .............................................107
Figure 7-36. Finished Thermocouple Installation................................................107
Figure 7-37. Thermocouple Wire Management...................................................108
Figure 7-38. Thermistor Set Points .................................................................. 110
Figure 7-39. Example Fan Speed Control Implementation ...................................111
Figure 7-40. Fan Speed Control.......................................................................112
Figure 7-41. Temperature Range = 5 °C...........................................................113
Figure 7-42. Temperature Range = 10 °C.........................................................114
Figure 7-43. On-Die Thermal Sensor and Thermistor..........................................115
Figure 7-44. FSC Definition Example................................................................117
Figure 7-45. System Airflow Illustration with System Monitor Point Area Identified .122
Figure 7-46. Thermal sensor Location Illustration ..............................................123
Figure 7-47. ATX/µATX Motherboard Keep-out Footprint Definition and Height
Restrictions for Enabling Components - Sheet 1..............................
129
Figure 7-48. ATX/µATX Motherboard Keep-out Footprint Definition and Height
Restrictions for Enabling Components - Sheet 2..............................130
Figure 7-49. ATX/µATX Motherboard Keep-out Footprint Definition and Height
Restrictions for Enabling Components - Sheet 3..............................
131
Figure 7-50. BTX Thermal Module Keep Out Volumetric – Sheet 1........................132
Figure 7-51. BTX Thermal Module Keep Out Volumetric – Sheet 2........................133
Figure 7-52. BTX Thermal Module Keep Out Volumetric – Sheet 3........................134
Figure 7-53. BTX Thermal Module Keep Out Volumetric – Sheet 4........................135
Figure 7-54. BTX Thermal Module Keep Out Volumetric – Sheet 5........................136
Figure 7-55. ATX Reference Clip – Sheet 1........................................................137
Figure 7-56. ATX Reference Clip - Sheet 2........................................................138
Figure 7-57. Reference Fastener - Sheet 1........................................................139
Figure 7-58. Reference Fastener - Sheet 2........................................................140
Figure 7-59. Reference Fastener - Sheet 3........................................................141
Figure 7-60. Reference Fastener - Sheet 4........................................................142
Figure 7-61. Intel
®
D60188-001 Reference Solution Assembly.............................143
Figure 7-62. Intel
®
D60188-001 Reference Solution Heatsink..............................144
Figure 7-63. Intel
®
E18764-001 Reference Solution Assembly ............................. 145

Intel E2180 - Pentium Dual-Core 2.00GHz 800MHz 1MB Socket 775 CPU Specifications

General

Brand	Intel
Model	E2180 - Pentium Dual-Core 2.00GHz 800MHz 1MB Socket 775 CPU
Category	Computer Hardware
Language	English